Development and Integration of Printed Electronics for Military Applications
Grand Ballroom G
12:45 - 13:10
Additive manufacturing, including integrated printed and flexible electronics, is revolutionizing how industry and Department of Defense (DoD) design, develop, and manufacture products and weapon systems. Recent advances have enabled the U.S. Army to design and develop numerous new processes and applications for munitions, Soldiers and weapons systems. By combining multiple AM technologies together (i.e. Metals, Plastics, Electronics, Energetics, etc.) the DoD is able to fabricate devices and systems previously unachievable. By integrating printed electronics, energetics, and power sources into/onto 3D structures, new solutions and applications can be realized to enhance our Warfighters' capabilities.
Researchers at the Army's Research Development and Engineering Command (RDEC) are working to ensure that U.S. forces continue to operate from a position of overwhelming military advantage. Recent advances in materials printing technologies have allowed revolutionary changes in design, materials, and fabrication of components and sub-systems for numerous military applications. The integration of printed electronics onto/into structures and hybrid devices is shaping how the Army designs, fabricates, integrates, manufactures, and tests their systems. These capabilities are helping the DoD and its strategic partners to capitalize on these technological breakthroughs and to develop systems that are "smarter," more rapidly deployable, lighter and smaller.
The current state-of-the-art and future concepts pertaining to printed technologies within the US Army will be presented. Examples of sensors, power sources, antennas, wearables, prognostic & diagnostic will be discussed. Also, the challenges associated with testing, qualification, and fielding for commercial and military markets will be discussed.
Speaker Biography (James Zunino)
Mr. James Zunino is a Materials Engineer within the Materials, Manufacturing and Prototype Technology Division, located at the U.S Army Research, Development and Engineering Center (ARDEC), Picatinny Arsenal, NJ. He holds a Master's of Business Administration and a B.S in Chemical Engineering from New Jersey Institute of Technology. Mr. Zunino serves as the ARDEC Subject Matter Expert on smart coatings, flexible electronics, material printing, and novel ink development. Mr. Zunino works with customers and end users to develop prototypes and provides solutions to help meet needs and requirements. He has received numerous awards including: Thomas Alva Edison Patent Award, Department of the Army Research and Development Achievement Award, IDTechEx Academic R&D, as well as other DoD and Industry awards.
Company Profile (US Army)
The Armament Research, Development and Engineering Center of the US Army Materiel Command. Its workforce provides lifecycle support for most of the Army's lethality used by the US Warfighter. Its missions are to improve existing field items, develop new items, maintain a strong armament technology base and provide technical support to soldiers in the field.