Aerosol Jet®, An Evolutionary Electronic Material Dispense Solution
Santa Clara Convention Center, CA, USA
Grand Ballroom G
17:20 - 17:40
Aerosol Jet printing has been deployed in mass production/customization of sensors, antenna, functional circuits onto non-planar substrates. It is being used to augment wirebond applications where pad to pad spacing and multiple stacked die cause cross-talk. Through its precise selective coating capability on all five sides of a package without depositing material on critical circuitry, Aerosol Jet printing is used as a viable alternative to PVD and Spray coating solutions. Mil-Aero electronic manufacturing companies use Aerosol Jet for dispensing conductive epoxies for super small component and die attach and as a method for printing underfill materials where component-to-component spacing is less than 100 microns. These are some of the areas where the Aerosol Jet printer is currently helping electronics manufacturers meet their production goals which will be discussed in this presentation.
Speaker Biography (Mike O'Reilly)
For the past 12 years, Mike has been responsible for leading Optomec's Aerosol Jet commercialization efforts within printed electronics and related markets. Prior to joining Optomec, Mike was Vice President of Product Marketing at Cadence Design Systems responsible for system level design and verification products. Mike has over 30 years of experience introducing advanced technology into the commercial sector.
Company Profile (Optomec)
Optomec is evolving the world of additive manufacturing by enabling new dimensions in 3D printing. The LENS and Aerosol Jet families of printers support a range of materials for metals, 3D printed electronics and other applications, and are able to implement feature sizes never before possible.