到2035年,芯粒市场价值将达4110亿美元,半导体行业实现转型

2025年-2035年芯粒技术:技术、机遇、应用

模块化架构、供应链弹性、异构集成、先进封装、先进互连和通信、热管理解决方案


显示全部 说明 内容、图表列表 价格 Related Content
本报告深入剖析了芯粒技术对半导体设计领域产生的变革性影响——在摩尔定律减速的背景之下,人们迫切需要更高的灵活性与成本效益。本报告着重阐述了供应链中各相关方所取得的显著进展,特别是在应对集成难题、优化互连与通信技术以及高效热管理等方面的突破。本报告还提供了一个为期十年的市场展望,预测至2035年,芯粒市场规模将迅猛扩张至4110亿美元,广泛应用于服务器、电信设备、个人电脑、智能手机乃至汽车制造等多个行业。通过对关键技术、市场趋势和供应链动态的深入解析,本报告成为人们解密芯粒的重要资源。
芯粒背景和动机
  • 芯粒技术概述及其对半导体设计的变革性影响。
  • 分析使芯粒设计具有吸引力的驱动因素和优势,如灵活性、模块化和成本效益。
  • 研究芯粒如何解决传统单片设计的局限性,提高良率并降低成本。
芯粒技术和挑战
  • 技术和制造工艺的见解,重点关注设计方法和封装技术。
  • 探索芯粒间通信,详细说明互连和无缝集成的标准。
  • 在密集封装的芯粒系统中有效热管理的策略。
  • 识别采用芯粒技术的挑战,包括集成复杂性和热管理问题。
市场预测和现状分析
  • 全面的市场预测,涵盖增长趋势和到2035年的未来展望。
  • 详细分析六个应用领域的10年预测,包括服务器、电信与5G与物联网、个人电脑、手机、汽车工业等。
  • 研究当前市场状况和趋势,突出关键参与者及其在推进芯粒技术中的作用。
  • 详细的供应链分析,强调关键参与者及其在推进芯粒技术中的作用。
 
  • 执行摘要与结论
• 10年市场预测
• 供应链分析
• 对半导体行业趋势的影响
  • 芯粒技术简介
  • 芯粒设计的驱动因素和优势
  • 采用和实施中的挑战
  • 技术和制造工艺
• 设计方法
• 封装技术
• 芯粒间通信
• 互连和标准
• 热管理策略
  • 芯粒技术的应用和使用案例
 
In the rapidly evolving world of semiconductors, chiplet technology is emerging as a groundbreaking approach that addresses many of the challenges faced by traditional monolithic System-on-Chip (SoC) designs. As Moore's Law slows down, the semiconductor industry is seeking innovative solutions to increase performance and functionality without merely increasing transistor density. Chiplets offer a promising path forward, providing flexibility, modularity, customizability, efficiency, and cost-effectiveness in chip design and manufacturing. Companies like AMD and Intel have been at the forefront of this technology, with products like AMD's EPYC processors and Intel's Ponte Vecchio data center GPU showcasing the potential of chiplets in boosting core counts and integrating diverse functionalities.
 
Chiplets are discrete modular semiconductor components that are co-designed and manufactured separately before being integrated into a larger system. This approach resembles a SoC on a module, where each chiplet is designed to function in conjunction with others, necessitating co-optimization in design. The modularity of chiplets aligns with key semiconductor trends such as IP chipletization, integration heterogeneity, and I/O incrementalization. Chiplet is also associated with heterogeneous integration and advanced packaging.
 
SoC vs Chiplet concept
 
Why Chiplets Are Gaining Traction
The slowdown of Moore's Law has made it increasingly difficult to add more transistors within a limited area. Instead, the focus has shifted to enhancing function density—an area where chiplet design excels. In the meantime, development efforts have increasingly focused on system-level integration rather than solely on wafer manufacturing.
 
The adoption of chiplet technology is driven by its ability to address several critical limitations inherent in traditional monolithic chip designs. One advantage is its capacity to overcome constraints such as reticle size and the memory wall, which traditionally hinder the performance and scalability of semiconductor devices. By modularizing chip functions into discrete chiplets, manufacturers can optimize the use of semiconductor materials and processing nodes more effectively. In addition, chiplets can achieve better utilization of wafer corner space and have lower defect rate on chips, which are often underutilized in conventional chip designs, particularly in larger SoCs that demand an increasing number of functions. The discrete components can be tested and validated individually before integration. As a result, the manufacturing yield increases, allowing for higher output quality and reduced costs per unit. Furthermore, chiplets facilitate a more flexible design process, enabling the integration of diverse functionalities tailored to specific applications without the need for entirely new chip designs. This flexibility not only reduces development time and costs but also allows for rapid adaptation to evolving technological demands.
 
The nature of chiplets allows manufacturers to source different parts from multiple suppliers across various regions. This diversification reduces dependency on any single supplier or geographic area, thereby enhancing supply chain resilience. In the context of geopolitical tensions and trade restrictions, chiplet technology provides a strategic advantage by mitigating risks associated with supply disruptions. By adopting chiplet designs, companies can navigate these constraints more effectively, ensuring a steady supply of critical components without relying heavily on regions subject to political instability or trade sanctions.
 
Collectively, these factors make chiplet technology an attractive option for manufacturers seeking to enhance performance while maintaining economic efficiency.
 
New functions/designs enabled by chiplet design
 
Current Market Landscape
The global market for chiplets is experiencing remarkable growth. Being projected to reach US$411 billion by 2035, driven by high-performance computing demands across sectors such as data centers and AI. The modular nature of chiplets allows for rapid innovation and customization, catering to specific market needs while reducing development timelines and costs.
 
While chiplets offer numerous advantages, they also present new challenges. The integration of multiple chiplets requires advanced interconnection technologies and standards to ensure seamless communication between components. Thermal management is another critical area, as increased function density can lead to overheating if not properly managed. These challenges open up opportunities for various players in the supply chain. For instance, different areas of the package in chiplet design require distinct types of underfill materials to address specific needs, e.g. to protect the chips themselves, providing mechanical support and thermal stability, as well as to safeguard the delicate wires and solder balls that connect the chiplets, preventing issues such as delamination or separation. This creates demand for innovative materials that enhance reliability and performance.
 
Report Coverage
The report provides a comprehensive analysis of the chiplet technology landscape, beginning with an executive summary offers an overview of the report's findings and insights, setting the stage for a detailed introduction to the basics of chiplet technology. The report explores the drivers and benefits that make chiplet design attractive, while also identifying the challenges and hurdles in its adoption and implementation. It provides insights into technology and manufacturing processes, including design methodologies and packaging techniques. The discussion extends to inter-chiplet communication, focusing on interconnects and standards necessary for seamless integration. Thermal management strategies are outlined to address heat management in densely packed systems. Finally, the report examines various application areas, showcasing use cases across different sectors that demonstrate the versatility and impact of chiplet technology. A 10-year market forecast segmented by application that examines growth trends and future projections is provided. It also delves into the supply chain, highlighting key players and their roles in advancing chiplet technology.
Key Aspects
 
Chiplet context and motivations
  • Overview of chiplet technology and its transformative impact on semiconductor design.
  • Analysis of drivers and benefits that make chiplet design attractive, such as flexibility, modularity, and cost-effectiveness.
  • Examination of how chiplets address limitations of traditional monolithic designs, improving yields and reducing costs.
 
Chiplet technologies and challenges
  • Insights into technology and manufacturing processes, focusing on design methodologies and packaging techniques.
  • Exploration of inter-chiplet communication, detailing interconnects and standards for seamless integration.
  • Strategies for effective thermal management in densely packed chiplet systems.
  • Identification of challenges in adopting chiplet technology, including integration complexities and thermal management issues.
 
Market forecast and status analysis
  • Comprehensive market forecast with growth trends and future projections up to 2035.
  • Detailed analysis covering a 10-year forecast for six application areas including server, telecommunications & 5G & IoT, PCs, mobile phones, automotive industry and others.
  • Examination of the current market status and trends, highlighting key players and their roles in advancing chiplet technology.
  • Detailed supply chain analysis highlighting key players and their roles in advancing chiplet technology.
Report MetricsDetails
CAGRThe global market for chiplet-form industry will reach US$411 billion by 2035, representing a CAGR of 14.7%
Forecast Period2025 - 2035
Forecast UnitsVolume (unit), value (US$ billion)
Regions CoveredWorldwide
Segments CoveredServer Telecommunications, 5G, IoT PCs Mobile phones Automotive industry Others
从 IDTechEx 访问分析师
所有报告购买订单均包括与一名专家分析师进行 30 分钟的电话交谈,专家分析师将帮助您将报告中的重要发现与您正在处理的业务问题联系起来。这需要在购买报告后的三个月内使用。
更多信息
如果您对这一报告有任何疑问,请随时联系我们的报告团队 research@IDTechEx.com 或致电我们的销售经理:

AMERICAS (USA): +1 617 577 7890
ASIA (Japan): +81 3 3216 7209
ASIA (Korea): +82 10 3896 6219
EUROPE (UK) +44 1223 812300
Table of Contents
1.EXECUTIVE SUMMARY
1.1.SoC, SiP vs chiplet
1.2.Current status of chiplet technology
1.3.Future trends in chiplet technology (1/2)
1.4.Future trends in chiplet technology (2/2)
1.5.Possible chiplet supply chain
1.6.Chiplet ecosystem across different periods
1.7.Analysis of possible chiplet supply chain (1/2)
1.8.Analysis of possible chiplet supply chain (2/2)
1.9.Opportunities unlocked by the chiplet platform
1.10.Chiplet impact
1.11.Convergence to chiplet
1.12.Chiplet adoption evolution
1.13.Market forecast coverage and methodologies
1.14.Forecast assumptions
1.15.Chiplet shipment unit forecast 2024-2035
1.16.Chiplet market forecast 2024-2035
1.17.Market share comparison 2024 vs 2030
1.18.Chiplet classifications
1.19.Application markets
1.20.Potential applications of chiplet technology (1/4)
1.21.Potential applications of chiplet technology (2/4)
1.22.Potential applications of chiplet technology (3/4)
1.23.Potential applications of chiplet technology (4/4)
2.INTRODUCTION TO CHIPLETS
2.1.Why now
2.2.From monolithic chips to chiplets
2.3.What is chiplet technology
2.4.Definition of chiplet
2.5.SoC vs Chiplet
2.6.Generic chiplet integration
2.7.SiP vs Chiplet
2.8.Heterogenous integration
2.9.Technology building blocks for heterogeneous integration
2.10.Types of heterogenous integration
2.11.Different types of chiplets for computation
3.DRIVERS AND BENEFITS OF CHIPLET DESIGN
3.1.Limitations of large dies
3.2.Benefits of small chips 1
3.3.Benefits of small chips 2
3.4.Monolithic dies may not provide enough memory
3.5.Increasing cost with advanced processing nodes
3.6.Costs trend with processing nodes
3.7.Costs reduction with processing nodes via Chiplet design
3.8.Improved supply chain security
3.9.IP Chipletization
3.10.Chiplet as a platform
3.11.3D IC design
3.12.Chiplet design for cost consideration
3.13.Other benefits of chiplet design
3.14.The rise of chiplets in semiconductor technology
4.CHALLENGES OF CHIPLET
4.1.Challenges with chiplets
4.2.Challenges from demand and supply angles
5.CHIPLET TECHNOLOGY AND MANUFACTURING
5.1.1.Technical structure of chiplets
5.2.Design
5.2.1.Co-design of high-performance chip-package-system
5.2.2.Chiplet design and integration
5.2.3.Challenges and solutions in EDA for chiplets (1/2)
5.2.4.Challenges and solutions in EDA for chiplets (2/2)
5.2.5.The three giants of EDA are shifting to a new battlefield
5.2.6.AI in EDA
5.3.Packaging and Assembly Technologies
5.3.1.Levels of integration
5.3.2.Traditional packaging
5.3.3.TSV enables integration beyond 2D dimension
5.3.4.From chip, package to system
5.3.5.Dimensionality of advanced packaging
5.3.6.From 1D semiconductor packaging
5.3.7.Advanced packaging 2D & 2D+
5.3.8.Advanced packaging 2.5D & 3D
5.3.9.Advanced packaging 3.5D & 4D
5.3.10.Advanced packaging trend
5.3.11.Key elements of advanced packaging
5.3.12.Silicon stacking: A key enabler of advanced packaging
5.3.13.Trends of advanced packaging
5.3.14.Representative Examples of Advanced Packaging
5.3.15.TSMC's advanced semiconductor packaging technology portfolio
5.3.16.TSMC 2.5D packaging technology - CoWoS
5.3.17.3D chiplet
5.3.18.Combine 3D SoIC and 2.5D backend packaging technologies
5.3.19.Intel's advanced semiconductor packaging technology portfolio
5.3.20.Intel's EMIB
5.3.21.Intel's Co-EMIB (EMIB + Foveros)
5.3.22.Samsung's advanced semiconductor packaging technology portfolio
5.3.23.Samsung's advanced packaging technologies
5.3.24.Amkor advanced semiconductor packaging solutions
5.3.25.Amkor's S-Connect
5.4.Inter-Chiplet Communication and Interconnects
5.4.1.Electrical interconnects
5.4.2.From aluminum to copper
5.4.3.Material considerations
5.4.4.Interconnect technologies for semiconductor packaging
5.4.5.Interface stack for chiplets
5.4.6.Interface for chiplet
5.4.7.D2D interface types
5.4.8.Serial vs parallel interface
5.4.9.112G USR/XSR vs HBI
5.4.10.Proprietary D2D interface standards
5.4.11.Proprietary D2D interface standard comparison
5.4.12.Open D2D interface standards
5.4.13.Open D2D interface standards comparison
5.4.14.Universal Chiplet Interconnect Express (UCIe)
5.4.15.NVIDIA NVLink-C2C
5.4.16.Standard protocols of heterogeneous computing
5.4.17.Relationship of chiplet interfaces, bandwidth and typical packages
5.4.18.Chiplet D2D I/O matrix
5.4.19.Recommended interconnect for applications
5.4.20.Interconnect classification
5.4.21.Interconnection technology I/O pitch & density
5.4.22.Bump technologies
5.4.23.Typical bump sizes and pitches
5.4.24.Hybrid bonding
5.4.25.SoIC compared to 2.5D and 3D IC
5.4.26.Alternative technologies to electric SerDes
5.4.27.Photonics technology for chiplet
5.4.28.Limitation of electrical copper I/O
5.4.29.From discrete III-V to CPO
5.4.30.Optical integration development trends
5.5.Power Delivery and Thermal Management
5.5.1.Power delivery
5.5.2.Power delivery attributes for chiplets
5.5.3.Heat dissipation of a chip
5.5.4.Basics about thermal management
5.5.5.Thermal challenges with chiplet design
5.5.6.Chiplet thermal management strategy
5.5.7.Key materials for packaging chiplet
5.5.8.Thermal interface materials
5.5.9.Strategies for semiconductor TIMs
5.5.10.TIM advancements
5.5.11.Heat sink material solutions
5.5.12.Optimizing heat sink design for advanced architectures
5.5.13.Other materials design consideration for thermal management
5.5.14.Material and process challenges in console failures
5.5.15.Warpage and solder joint issues
5.5.16.Cooling system for chips
5.5.17.Liquid cooling options
5.5.18.Design considerations for in-chip Cooling in 3D Chip stacks
5.5.19.Impingement cooling
5.5.20.Micro-heat pipes
5.5.21.TIM and cooling technologies limits
5.6.Others
5.6.1.Test access architecture
5.6.2.Testing for chiplets:
5.6.3.Chiplet testing
5.6.4.Different test techniques
5.6.5.Repair and redundancy
5.6.6.Antenna effect
5.6.7.Electromagnetic interference in chiplets
6.APPLICATION AREAS AND USE CASES
6.1.Chiplet for high performance computing chips
6.2.Chiplet use cases 1
6.3.Chiplet use cases 2
6.4.Marvell's Mochi
6.5.DARPA's work 1
6.6.DARPA's work 2
6.7.Chiplet architecture used in Apple chips
6.8.Apple's UltraFusion technology
6.9.Intel's contributions to chiplet
6.10.Intel's Ponte Vecchio
6.11.Intel's Agilex FPGAs
6.12.Intel Gaudi 3
6.13.AMD's chiplet history
6.14.AMD's 1st generation EPYC
6.15.AMD's 2nd generation EPYC
6.16.AMD Chiplet cost
6.17.Genoa and MI300
6.18.AMD's GPU based on chiplet design
6.19.Nvidia B200
6.20.AWS Graviton 4
6.21.Alphawave Semi's efforts
6.22.Ayar Labs' TeraPHY optical I/O chiplet
6.23.The first Chiplet Factory
6.24.Tenstorrent's chiplet technology
6.25.Eliyan's interconnects
6.26.Kiwi Moore's Kiwi SoChiplet Platform
6.27.Japanese automotive chiplet research group
6.28.European chiplet supply chain project
6.29.Imec's automotive chiplet initiative
 

Ordering Information

2025年-2035年芯粒技术:技术、机遇、应用

£$¥
电子版(1-5 名用户)
£5,650.00
电子版(6-10 名用户)
£8,050.00
电子版及 1 份硬拷贝文件(1-5 名用户)
£6,450.00
电子版及 1 份硬拷贝文件(6-10 名用户)
£8,850.00
电子版(1-5 名用户)
€6,400.00
电子版(6-10 名用户)
€9,100.00
电子版及 1 份硬拷贝文件(1-5 名用户)
€7,310.00
电子版及 1 份硬拷贝文件(6-10 名用户)
€10,010.00
电子版(1-5 名用户)
$7,000.00
电子版(6-10 名用户)
$10,000.00
电子版及 1 份硬拷贝文件(1-5 名用户)
$7,975.00
电子版及 1 份硬拷贝文件(6-10 名用户)
$10,975.00
电子版(1-5 名用户)
元50,000.00
电子版(6-10 名用户)
元72,000.00
电子版及 1 份硬拷贝文件(1-5 名用户)
元58,000.00
电子版及 1 份硬拷贝文件(6-10 名用户)
元80,000.00
电子版(1-5 名用户)
¥990,000
电子版(6-10 名用户)
¥1,406,000
电子版及 1 份硬拷贝文件(1-5 名用户)
¥1,140,000
电子版及 1 份硬拷贝文件(6-10 名用户)
¥1,556,000
Click here to enquire about additional licenses.
If you are a reseller/distributor please contact us before ordering.
お問合せ、見積および請求書が必要な方はm.murakoshi@idtechex.com までご連絡ください。

报告统计信息

幻灯片 192
预测 2035
已发表 Oct 2024
ISBN 9781835700693
 

预览内容

pdf Document Sample pages
 
 
 
 

Subscription Enquiry