2025年-2035年硅光子和光子集成电路：技术、市场、预测

本报告对硅光子学和光子集成电路（PICs）市场进行了全面分析，涵盖以下主题：

 

本报告基于广泛的研究和与行业专家的访谈，为任何对光子集成电路未来感兴趣的人士提供了宝贵的见解。

 

市场预测：

 

本报告涵盖的主要内容：

• 技术背景：什么是硅光子学？

• 光子集成电路关键概念

• 关于SOI（绝缘体上硅）、SiN（氮化硅）、InP（磷化铟）、TFLN（薄膜铌酸锂）、BTO（钛酸钡）、聚合物及稀土金属的讨论、基准测试及关键公司分析。

• 半导体能源危机

• 用于数据中心高性能收发器的光子集成电路

• 用于设备间互连的光子集成电路

• 高级封装与共封装光学

• 混合集成：共封装光学

• 用于人工智能和类脑计算的光子引擎与加速器

• 用于量子计算的光子集成电路

• 基于光子集成电路的传感器

• 基于光子集成电路的LiDAR

 

Photonic Integrated Circuits (PICs) are tiny optical systems made out of materials such as Silica (Glass), Silicon, or Indium Phosphide. PICs enable everything from complex optical designs that allow billions of bits of information to be sent and received in a package the size of a candy bar to artificial noses that can detect different compounds and molecules in the air around them. Their importance in high-speed communication within AI data centers is leading to rapid growth in demand for PIC-enabled transceivers to help machine learning models grow ever larger.

 

By leveraging the billions of dollars in investment in CMOS chip manufacturing, PICs can unlock new processing scaling potential beyond Moore's law. However, there are still significant challenges for the PIC market, such as material limitations, integration complexity, and cost management. Large demand volumes are required to offset the initial cost of designing and manufacturing PICs, and production lead times can take months. IDTechEx's new PIC report thoroughly investigates the PIC market and has identified Photonic Transceivers for AI as an emerging segment that is soon to be the largest source of demand for PICs.

 

There is a wide variety of future PIC materials. Most of the current market uses Silicon and Silica-based PICs for light propagation. However, as an indirect bandgap semiconductor, silicon is not a practical light source or photodetector. Therefore, silicon is usually combined with III-V materials for light sources and photodetection. Leveraging the enormous existing integrated circuit manufacturing industry and generally taking advantage of mature node processes, silicon's market dominance is set to continue.

 

However, Thin Film Lithium Niobate (TFLN), with its moderate Pockels effect and low material loss, is emerging as a strong contender for applications that require high-performance modulation such as quantum systems or potentially high-performance transceivers in the future. Monolithic Indium Phosphide (InP) continues to be a major player due to its ability to detect and emit light. Additionally, innovative materials like Barium Titanite (BTO) and rare-earth metals are being explored for their potential in quantum computing and other cutting-edge applications.

 

The rise of Artificial Intelligence (AI) has spurred an unprecedented demand for high-performance transceivers capable of supporting the massive data rates required by AI accelerators and data centers. Silicon Photonics and PICs are at the forefront of this revolution, with their ability to transmit data at speeds of 1.6Tbps and beyond. As shown by Nvidia's latest H200 server units, which according to IDTechEx's research, require approximately 2.5 800G transceivers per GPU, the need for efficient, high-bandwidth communication is becoming more critical for AI, positioning Silicon Photonics and PICs as essential components in the AI-driven future. The biggest driver of the development of PIC transceivers is AI, as higher-performance AI accelerators will require higher-performance transceivers, with 3.2Tbps transceivers expected to arrive by 2026.

 

Other applications for Silicon Photonics and PICs vary - from high-bandwidth chip-to-chip interconnects to advanced packaging and co-packaged optics, these technologies are paving the way for next-generation computing.

 

Photonic Engines and Accelerators: Using certain photonic components such as Mach-Zehnder Interferometers, and controlling these components through electro-optical interconnects, high-performance processors and programmable PIC devices can be designed and manufactured, unlocking higher performance than what is possible with electronic accelerators alone.

 

PIC-based Sensors: Certain PIC materials, such as Silicon Nitride, can used for a range of different sensors, from gas sensors to 'artificial noses'. The healthcare sensor industry may be able to take advantage of the miniaturization of optical components into PIC devices, which could see applications in Point-of-Care diagnostics or wearables.

 

PIC-based FMCW LiDAR has the potential to transform the automotive and agricultural industries with applications in drones and autonomous vehicles.

 

Quantum Systems: Companies investing in Trapped Ion and Photon-based Quantum Computing are looking to PICs for more stable and scalable quantum systems. The challenge lies in achieving the precise control of photons necessary for quantum computation.

 

 

The market for Silicon Photonics and PICs is experiencing robust growth, driven by the surge in AI and datacom transceiver demand. Key players in the industry such as Intel/Jabil, Coherent, and Infinera are actively using PICs within their transceivers. Innolight, a China-based transceiver company, hit 1.6Tbps of transfer speed in their latest transceivers in late 2023. Coherent, which has its own InP wafer fab facilities, is also developing higher-performance transceivers for 1.6T+ applications. Intel Silicon Photonics, which has transferred its transceiver business to Jabil, announced it had shipped over 8 million PICs since 2016, showing the maturity of the technology. IDTechEx forecasts that PIC technology is to continue to dominate the high-performance transceiver market, further solidifying its position as a critical component in the modern technological landscape.

 

This report includes a detailed examination of the latest innovations in Silicon Photonics and Photonic Integrated Circuits, key technical trends, analysis across the value chain, major player analysis, and granular market forecasts.

 

The report covers the following topics:

 

The report is based on extensive research and interviews with industry experts and provides valuable insights for anyone interested in the future of photonic integrated circuits. It includes 32 company profiles, many from first-hand interviews, and summaries from events including SPIE Photonex 2024 and SPIE Photonics West 2024.

 

Market Forecasts:

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