Speakers from the world's largest organisations will share their needs & experiences with many world first announcements. Learn of the requirements and case studies from end users and hear all about the latest innovations from companies across the value chain. In total, hear insights from 250 speakers.
Smart Hybrid Electronics - Addressing The Scale Up Challenge
Estrel Convention Center, Berlin, Germany
12:20 - 12:40
The National Printable Electronics Centre located at the Centre for Process Innovation (CPI) is the UK national prototyping facility for the development and commercialisation of printable electronics.
The wide availability of Near Field Communication (NFC) with smartphones is driving new applications such as electronic payments and can now be further extended to enable direct interaction between printed media (labels, posters, documents, and packaging) with integrated electronics and the smartphone. These new application concepts address the needs of marketing, games and anti-counterfeit, and also provide a platform to provide more complex thin-film electronics within smart packaging (e.g. food, medical) and supply-chain logistics (e.g. retail).
This talk will focus on introducing CPIs newly built facility for delivering applications within this emerging space. Opened in summer 2018, CPI have installed and commissioned state of the art capability in roll to roll printing, integration and converting capability for the production of functional inlays and labels. The printing toolset is a standard graphics printing press configured with a range of printing techniques, gravure, screen, and flexographic for characterising functional inks. The integration toolset is configured with a number of modules including jetting capability of conductive adhesives, bare die flip chip attach, reel fed direct attach for surface mount components (LEDs, capacitors, resistors etc.) thermode curing and oven curing, glob top encapsulation, and inspection capability. The converting toolset is configured with a number of modules to allow the conversion of functional inlays into wet / dry labels for a range of packaging solutions. In addition to the larger scale equipment, an electronics design suite and batch prototyping equipment allows concepts and early prototypes to be conceived, designed and tested at batch scale prior to scaling up to higher volumes. The talk will also review CPIs involvement in both UK and EU funded projects currently active with the IOT space. These projects address a major barrier to the commercialisation of printable electronics, namely the establishment of large-scale manufacturing and technology transfer to multiple application sectors.
Speaker Biography (Mike Clausen)
Mike is the Head of Technology within the CPI Printable Electronics platform. He is responsible for providing technical leadership, developing technologies so that they can be translated to innovative products capable of commercialization in the future. Mike has 25 years' experience within the electronics field working within research and development, mass production and customer service environments. He has worked for medium size British companies and major international blue chip organisations such as Fujitsu Microelectronics, NXP, Filtronic Compound Semiconductors and RFMD. His knowledge base spans Operations management, process engineering and integration, technology development, yield enhancement and project management.
Company Profile (CPI)
CPI's Printable Electronics Centre is a design, development and prototyping facility. We provide support in bringing new printable electronics products and processes to market quickly by offering facilities and expertise that help reduce our clients' level of R&D risk and capital investment.
Taking advantage of our state of the art deposition, patterning and printing equipment leads to faster, more efficient development and production enabling clients to enter new markets quickly and with minimal risk. CPI can accelerate new product development by providing access to proven performance conducting, semiconductor, resistive materials and inks.