Designing And Making Parts Using Injection Molded Structural Electronics (IMSE™)
Santa Clara Convention Center, CA, USA
Grand Ballroom G
16:40 - 17:00
TactoTek Injection Molded Structural Electronics (IMSE™) is a solution that combines in-mold labeling and surface decoration, printed electronics (circuitry, sensors, and antennas) and discrete electronic components (LEDs, ICs, etc.) inside of 3D plastic structures, thus changing the 100 years old picture of electronics as "components in a box" into thin, light and durable 3D smart plastic surfaces.
Together with multiple representative use-cases in different fields, we provide details on the mechanical, electrical, and optical design techniques and considerations for a specific use case: a seamless and elegant IMSE™ automotive overhead control panel (OHCP).
Dr. Antti Keränen is the technology mastermind behind TactoTek structural electronics. His main responsibilities are developing and maintaining the IP portfolio, directing R&D innovation activities, and communicating the company technology vision and practical applications to the community. Antti has been a major contributor to the technology of in-mold electronics since 2005, when he joined the VTT printed electronics team. He is an Adjunct Professor of theoretical physics at the University of Oulu where he earned his PhD in 2002.
TactoTek Injection Molded Structural Electronics (IMSE™) is a revolutionary technology that changes the way electronic parts such as HMI surfaces are designed and built. It integrates printed electronics (circuitry, sensors, and antennas) and discrete electronic components (LEDs, ICs, etc.) inside of thin 3D plastic structures. Embedding functionality such as lighting, controls, gesture sensors and antennas within 3D-shaped surface structures significantly reduces the thickness and weight of parts, delivers excellent touch and antenna performance and brings unique design opportunities for the next generation of HMIs.