Masterclasses
There are two optional pre-conference Masterclasses designed to
ensure you get the most out of the event by brigning you up to
date with the latest applications, technologies and company activities,
giving you the big picture. Led by experts, it is the ideal time
to voice your questions as part of the interactive session and
learn of the toolkit of technologies that are available and emerging
and their applications.
Masterclass 1: RFID and Smart Packaging
Monday 18 April 08:30-12:30
Presenter: Raghu Das & Dr Peter Harrop, IDTechEx Ltd, UK
RFID
- RFID Systems and components
- The benefits and payback of
RFID, examples of RFID being used, how many have been sold and
into which markets
- New applications and advice
on entry to market
- Chip and chipless tag technology
evaluations and their applications
- The place for printed electronics
in RFID
- The Electronic Product Code
(EPC) and other global initiatives
- Companies driving RFID adoption
– the major and small players
- RFID forecasts and trends 2005-2020
Smart
Packaging beyond RFID and EAS
- Mechanical, chemical, electrical
and electronic smarts in packaging
- Non-electronic & electronic
laminates for brand enhancement & diagnostics
- Organic and printed electronics
– technologies and their impact
- The exploding market for smart
medicine, food condition monitoring, brand enhancements, novelties
- Opportunities for packaging
- combining electronics with packaging
All workshop attendees
also receive 6 months access to Smart Labels Analyst and will
be able to study RFID tag samples.
12:30
- 13:30 Lunch for delegates for both masterclasses
Masterclass 2: Printed Electronics Introductory Masterclass
SOLD
OUT IN 2004 WITH OVER 70 ATTENDEES
Monday 18 April 12:30-17:30
Presenters: Dr Peter Harrop & Raghu Das, IDTechEx Ltd, UK
Designed for those who
are new to this disruptive technology or need to understand the
big picture to assess the challenges and opportunities, this Masterclass
will arm you with the latest knowledge of the applications and
technology developments involving printed electronics.
The session will cover:
- Applications of printed electronics – now and near
future
- Lessons to be learnt from early successes and failures
- The value chain
- Market forecasts
- The need for printed electronics
- Key markets that need printed electronics – reasons
why and their technology requirements
- Creating new markets versus competing with conventional electronics
in existing ones
- Assessment of technologies, companies, strategies and progress
so far, including
- Thin film transistor circuits (organic, inorganic semiconductors,
thin film silicon)
- Displays (OLEDs, electrophoretic, electroluminescene, electrochromic
and others)
- Sensors and conductive inks
- Batteries and actuators
- A discussion of printing techniques, their relevancy and
challenges
- Challenges and the roadmap to the full printed electronics
toolkit
All workshop attendees
also receive 6 months access to Smart Packaging Journal and will
be able to study some samples of printed electronics.
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