Masterclasses


There are two optional pre-conference Masterclasses designed to ensure you get the most out of the event by brigning you up to date with the latest applications, technologies and company activities, giving you the big picture. Led by experts, it is the ideal time to voice your questions as part of the interactive session and learn of the toolkit of technologies that are available and emerging and their applications.


Masterclass 1: RFID and Smart Packaging

Monday 18 April 08:30-12:30 Presenter: Raghu Das & Dr Peter Harrop, IDTechEx Ltd, UK

RFID

  • RFID Systems and components
  • The benefits and payback of RFID, examples of RFID being used, how many have been sold and
    into which markets
  • New applications and advice on entry to market
  • Chip and chipless tag technology evaluations and their applications
  • The place for printed electronics in RFID
  • The Electronic Product Code (EPC) and other global initiatives
  • Companies driving RFID adoption – the major and small players
  • RFID forecasts and trends 2005-2020

Smart Packaging beyond RFID and EAS

  • Mechanical, chemical, electrical and electronic smarts in packaging
  • Non-electronic & electronic laminates for brand enhancement & diagnostics
  • Organic and printed electronics – technologies and their impact
  • The exploding market for smart medicine, food condition monitoring, brand enhancements, novelties
  • Opportunities for packaging - combining electronics with packaging

All workshop attendees also receive 6 months access to Smart Labels Analyst and will be able to study RFID tag samples.

12:30 - 13:30 Lunch for delegates for both masterclasses


Masterclass 2: Printed Electronics Introductory Masterclass

SOLD OUT IN 2004 WITH OVER 70 ATTENDEES

Monday 18 April 12:30-17:30 Presenters: Dr Peter Harrop & Raghu Das, IDTechEx Ltd, UK

Designed for those who are new to this disruptive technology or need to understand the big picture to assess the challenges and opportunities, this Masterclass will arm you with the latest knowledge of the applications and technology developments involving printed electronics.

The session will cover:

  • Applications of printed electronics – now and near future
  • Lessons to be learnt from early successes and failures
  • The value chain
  • Market forecasts
  • The need for printed electronics
  • Key markets that need printed electronics – reasons why and their technology requirements
  • Creating new markets versus competing with conventional electronics in existing ones
  • Assessment of technologies, companies, strategies and progress so far, including
  • Thin film transistor circuits (organic, inorganic semiconductors, thin film silicon)
  • Displays (OLEDs, electrophoretic, electroluminescene, electrochromic and others)
  • Sensors and conductive inks
  • Batteries and actuators
  • A discussion of printing techniques, their relevancy and challenges
  • Challenges and the roadmap to the full printed electronics toolkit

All workshop attendees also receive 6 months access to Smart Packaging Journal and will be able to study some samples of printed electronics.



Coming soon... Printed Electronics USA 2005, December, USA.
 
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Sponsors

Acreo

Conductive Inkjet Technology

Coveme

Cypak

Pelikon

Plastic Logic

The Technology Partnership

Veeco

XINK

Media Sponsors

Organic Electronics Association

Taiwan Packaging Industry Network

Universal Packaging Alliance