Latest Printed Electronics News & Analysis from IDTechEx
Taken from the free daily IDTechEx service Printed Electronics World - see www.EnergyHarvestingJournal.com
For a list of IDTechEx research on printed electronics and allied technologies, see www.IDTechEx.com/research.
22 May 2023
Component Attach: Market readiness of solders & conductive adhesives
An innovation roadmap comparing component attachment size for sustainable electronics manufacturing.
19 May 2023
How Can Smart Packaging Best Add Value?
What is packaging for? From its initial purpose of simply protecting the product to driving sales via consumer engagement, the role of packaging has substantially evolved. Smart/intelligent packaging continues this trend towards greater functionality, employing sensors, printed electronics, and wireless communication to add value in novel ways.
19 May 2023
Smart Packaging Industry Overview
Innovation roadmap for the smart packaging industry.
15 May 2023
Advanced Semiconductor Packaging: Trends and Growth Drivers
Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually packaged and integrated at the PCB board level, but as devices become smaller and require higher processing capabilities, component integration needs to be pushed beyond board level.
09 May 2023
Webinar: The Growth Potential of Nuclear Small Modular Reactors
Thursday 25 May 2023 - How can SMRs open new use-cases for nuclear energy, decarbonizing problem industries in the process? Where in the world are SMRs developing today and where would they be expected to see greatest success? Are evolutionary vs. revolutionary approaches to reactor design more likely to see success in the global SMR fleet? What are the major roadblocks to deployment of SMRs and how could these be overcome? What players are working on SMRs and who is closest to delivering outside of Russia and China?