Conference Agenda

Tuesday, 08 Apr 2008

 Keynote
10:10Exhibition and Networking Break
11:10Nanosolar
10:45University of Cambridge
08:55Polymer Vision
08:30IDTechEx
09:45Hewlett Packard Laboratories
09:20LG Display
11:35Thorn Lighting Ltd
12:00Lunch and Networking Break

Track 1

 Applications
13:55Cubic Corporation
14:20The Compliers Group B.V.
14:45University of Cambridge
15:10Exhibition and Networking Break
15:50Osmotronic
13:30CPI
 Paper & Packing
16:40Stora Enso
17:05Mid Sweden University
17:30Printed Systems GMBH
16:15Abo Akademi University
17:05Sensible Solutions - Mid Sweden University
17:55Day One Ends

Track 2

 Logic & Memory
13:30Sony Corporation
15:10Exhibition and Networking Break
16:15Motorola
14:45Sunchon National University
14:20University of Minnesota
13:55Philips Applied Technologies
15:50Oregon State University
 Printed RFID & Anti-Counterfeiting
17:30Menippos GmbH
17:05InkSure
16:40PolyIC GmbH & Co. KG
17:55Day One Ends

Wednesday, 09 Apr 2008

Track 1

 Photovoltaics
09:35Konarka Austria R&D GmbH
10:00CEA
08:45Heliatek GmbH
09:10Univ. of Applied Sciences of Southern Switzerland
10:25Exhibition and Networking Break
 Printed Electronics Manufacture
11:25FUJIFILM Dimatix
11:00ImageXpert
12:40Lunch and Networking Break
14:00Seiko Epson Corp
11:50Optomec Inc
12:15Trident Industrial Inkjet
15:15Exhibition and Networking Break
16:00Welsh Centre for Printing and Coating
14:50MAN Roland
14:25Pixdro/OTB
 Modelling, Testing, Reliability
16:50Beltronics
16:25sim4tec GmbH
17:15Conference Ends

Track 2

 Conformal & Large Area Electronics
09:10Plastic Logic GmbH
08:45SiPix Imaging Inc.
 Displays
09:35iSuppli
10:25Exhibition and Networking Break
11:00Samsung Advanced Institute of Technology
11:25Novaled AG
11:50NTERA
10:00MicroEmissive Displays
 Lighting
12:40Lunch and Networking Break
14:25TNO/Holst Centre
14:00Institut fuer Angewandte Photophysik
12:15Schreiner Group GmbH & Co
 Batteries & Sensors
15:15Exhibition and Networking Break
16:00NANOIDENT AG
14:50University of California
16:25Prelonic Technologies OG
16:50Conference Ends

Track 3

 Materials
09:10Merck Chemicals Ltd
10:25Exhibition and Networking Break
11:00NanoMas Technologies
11:50Plextronics Inc
11:25Cima NanoTech
10:00DuPont MCM (UK) Ltd
09:35BASF Future Business GmbH
08:45Chisso Petrochemical Corporation
 Replacing Rare Materials
12:15HC Starck
12:40Lunch and Networking Break
14:00University of Augsburg
 Progress in Biggest Territories
14:50UK Displays & Lighting Network
15:15Exhibition and Networking Break
16:00Organic Electronics Association (OE-A)
16:25IDTechEx
14:25Invest in Germany GmbH
16:50Conference Ends
 
 
 

Wednesday April 09, 2008

Printed Electronics Manufacture (11:00 - 16:25)

ImageXpert, United States, Mr Yair Kipman, President
11:00 - 11:25 "Inspection Systems for Printed Electronics"
  • Interactive and automated systems for 2-D optical inspection
  • 3-D analysis though laser height profiling
  • Print head performance evaluation through analysis of drops-in-flight
  • Example applications
 
FUJIFILM Dimatix, Inc., United States, Mr Chuck Griggs, VP Technical Support
11:25 - 11:50 "Ink Jet Technology for Printed Electronics"
  • Technology status
  • Printed electronic applications
  • Ink jet equipment
 
Optomec Inc, United States, Mr Michael O'Reilly, Executive Product Development Manager
11:50 - 12:15 "M3D Aerosol Jet for Photovoltaics"
  • M3D Aerosol Jet print solution
  • Printed electronic applications
  • Meeting PV metallization requirements
 
Trident Industrial Inkjet, United States, Mr Steve Liker, Business Manager
12:15 - 12:40 "Digital Fabrication using Flexible Inert Piezo Ink Jet"
  • Current Manufacturing Challenges
  • Ink Jet as Solution
  • Case Study Successes
 
12:40 Lunch and Networking Break
 
Seiko Epson Corp, Japan, Mr Koichi Mizugaki,
14:00 - 14:25 "Inkjetted Metal Wiring"
  • Overview of Micro Piezo Technology
  • Application for LTCC substrate
  • Possibility for embeded package
 
Pixdro/OTB, Netherlands, Mr Peter Diepens, COO
14:25 - 14:50 "From Application Development to Industrial Production Equipment"
  • System development
  • Application cases
  • PixDro tools / modules
 
MAN Roland, Germany, Mr Thomas Walther, Head of Development
14:50 - 15:15 "The Important Role of the Printing Industry in RFID Integration in Consumer Packaging"
 
 
15:15 Exhibition and Networking Break
 
Welsh Centre for Printing and Coating, United Kingdom, Dr Eifion Jewell, Research Officer
16:00 - 16:25 "Printed Electronics by Flexography"
  • Flexography as a means of manufacturing printed electronics.
  • Compare and contrast with other printing processes.
  • Report on WCPC's research to produce flexible electronic devices.
 
 
Attended by over 350 delegates in 2007! Printed Electronics Europe 2008 will be the biggest event covering the topic.