Conference Agenda

Tuesday, 08 Apr 2008

 Keynote
10:10Exhibition and Networking Break
11:10Nanosolar
10:45University of Cambridge
08:55Polymer Vision
08:30IDTechEx
09:45Hewlett Packard Laboratories
09:20LG Display
11:35Thorn Lighting Ltd
12:00Lunch and Networking Break

Track 1

 Applications
13:55Cubic Corporation
14:20The Compliers Group B.V.
14:45University of Cambridge
15:10Exhibition and Networking Break
15:50Osmotronic
13:30CPI
 Paper & Packing
16:40Stora Enso
17:05Mid Sweden University
17:30Printed Systems GMBH
16:15Abo Akademi University
17:05Sensible Solutions - Mid Sweden University
17:55Day One Ends

Track 2

 Logic & Memory
13:30Sony Corporation
15:10Exhibition and Networking Break
16:15Motorola
14:45Sunchon National University
14:20University of Minnesota
13:55Philips Applied Technologies
15:50Oregon State University
 Printed RFID & Anti-Counterfeiting
17:30Menippos GmbH
17:05InkSure
16:40PolyIC GmbH & Co. KG
17:55Day One Ends

Wednesday, 09 Apr 2008

Track 1

 Photovoltaics
09:35Konarka Austria R&D GmbH
10:00CEA
08:45Heliatek GmbH
09:10Univ. of Applied Sciences of Southern Switzerland
10:25Exhibition and Networking Break
 Printed Electronics Manufacture
11:25FUJIFILM Dimatix
11:00ImageXpert
12:40Lunch and Networking Break
14:00Seiko Epson Corp
11:50Optomec Inc
12:15Trident Industrial Inkjet
15:15Exhibition and Networking Break
16:00Welsh Centre for Printing and Coating
14:50MAN Roland
14:25Pixdro/OTB
 Modelling, Testing, Reliability
16:50Beltronics
16:25sim4tec GmbH
17:15Conference Ends

Track 2

 Conformal & Large Area Electronics
09:10Plastic Logic GmbH
08:45SiPix Imaging Inc.
 Displays
09:35iSuppli
10:25Exhibition and Networking Break
11:00Samsung Advanced Institute of Technology
11:25Novaled AG
11:50NTERA
10:00MicroEmissive Displays
 Lighting
12:40Lunch and Networking Break
14:25TNO/Holst Centre
14:00Institut fuer Angewandte Photophysik
12:15Schreiner Group GmbH & Co
 Batteries & Sensors
15:15Exhibition and Networking Break
16:00NANOIDENT AG
14:50University of California
16:25Prelonic Technologies OG
16:50Conference Ends

Track 3

 Materials
09:10Merck Chemicals Ltd
10:25Exhibition and Networking Break
11:00NanoMas Technologies
11:50Plextronics Inc
11:25Cima NanoTech
10:00DuPont MCM (UK) Ltd
09:35BASF Future Business GmbH
08:45Chisso Petrochemical Corporation
 Replacing Rare Materials
12:15HC Starck
12:40Lunch and Networking Break
14:00University of Augsburg
 Progress in Biggest Territories
14:50UK Displays & Lighting Network
15:15Exhibition and Networking Break
16:00Organic Electronics Association (OE-A)
16:25IDTechEx
14:25Invest in Germany GmbH
16:50Conference Ends
 
 
 

Wednesday April 09, 2008

Materials (08:45 - 12:15)

08:45 - 09:10 "Chisso's High Functional Inks - Key Materials for Industrialization of Ink Jet Printing System"
  • Dielectric polyimide ink and high sensitive UV curable ink that are suitable for ink jet printing.
  • Extremely high concentrated polyimide ink, which is potentially applicable to thicker films.
  • Films that are prepared from the developed UV curable ink have significantly higher resistance properties.
 
09:10 - 09:35 "Printable Organic Semiconducting Materials and Formulations - Combining High Performance and Air Stability"
  • What is required from organic semiconducting materials and processes?
  • How can we print and process OSC's?
  • Examples of printed TFT performance we obtain.
 
09:35 - 10:00 "Progress in materials development for printed electronics"
  • BASF's involvement in printed electronics
  • Sepiolid (TM) product range
  • Application in CMOS circuitry
 
10:00 - 10:25 "DuPont Microcircuit Materials in Printed Electronics"
  • An introduction to DuPont Microcircuit Materials and the use of their inks in Printed Electronics.
  • Real life applications - inks for RFID, EL, Biomedical, Interconnects, PV and more.
  • Future directions - DuPont and Printed Electronics.
 
10:25 Exhibition and Networking Break
 
11:00 - 11:25 "Low-Temperature Sintering Nanoparticle Inks for Printed Electronics"
  • Printing highly conductive metal films with low-temperature sintering nanoparticle inks
  • Key issues that affect on performance and cost of nanoparticle inks
  • Applications using low-temperature sintering nanoparticle inks
 
11:25 - 11:50 "Self Assembling Nano-particle based Transparent Conductive Coatings"
  • Market Trends in Transparent Conductive Coatings
  • Application Examples
  • Cima Nanotech's Self Assembling Technology
 
11:50 - 12:15 "Plexcore® OC Ink for OLED HIL Addressing Core Technology Needs for Commercialization"
 
 
 
Attended by over 350 delegates in 2007! Printed Electronics Europe 2008 will be the biggest event covering the topic.