Functionalizing Structures Via Aerosol Jet 3D Printed Electronics
Santa Clara Convention Center, CA, USA
Grand Ballroom H
15:20 - 15:40
Structural Electronics is emerging as a new way of adding intelligence into products such as automobiles, turbine engines, medical devices, and building infrastructure. These functions can be used to sense, report on, and take or recommend corrective actions when products are deviating from their specifications. Optomec Aerosol Jet printers deliver the unique ability to print electronic and other materials onto any type of 2D and 3D structure, in dimensions ranging from 10 microns up to centimeters in scale. Aerosol Jet 3D printed electronics solutions have been deployed to add intelligence to products enabling continuous monitoring and feedback. This added functionality facilitates just-in-time corrective action helping to insure steady state operation of the functionalized products. Real world examples will be presented including printed creep sensors on turbine blades to monitor metal fatigue; printed temperature sensors onto catheters to insure proper operation of critical arterial ablation procedures; printed strain sensor on rotary shafts providing instantaneous feedback on torque related issues; and printed gas sensors on well-heads for detecting excess methane leakage.
Speaker Biography (Mike O'Reilly)
For the past 12 years, Mike has been responsible for leading Optomec's Aerosol Jet commercialization efforts within printed electronics and related markets. Prior to joining Optomec, Mike was Vice President of Product Marketing at Cadence Design Systems responsible for system level design and verification products. Mike has over 30 years of experience introducing advanced technology into the commercial sector.
Company Profile (Optomec)
Optomec is evolving the world of additive manufacturing by enabling new dimensions in 3D printing. The LENS and Aerosol Jet families of printers support a range of materials for metals, 3D printed electronics and other applications, and are able to implement feature sizes never before possible.