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Speakers from the world's largest organizations will share their needs and experiences with many world first announcements. Learn of the requirements and case studies from end users and hear all about the latest innovations from companies across the value chain. In total, hear insights from 250 speakers. Register now!
IC packages are getting thinner to facilitate thinner devices. Labels and tags are getting smarter, boards with embedded ICs are being developed and low profile requirements are needed to maximize product assemblies. Wireless electronics is starting to bend. Semiconductor-on-Polymer (SoP) Chip Scale Packaging (CSP) is enabling ultra-thin flexible hybrid Bluetooth Low Energy™ (BLE) electronics and sensors today. This presentation shares the development of SoP CSP based on Nordic Semiconductor's BLE SOCs, direct interconnect (DI) assembly and the FHE sensor system platform demonstrations. The presentation also shows the new production capacity for SoP based FHE and the technology roadmap for SoP application to IC packaging.
Mr. Hackler is an industry leader experienced in engineering, operations, marketing and management. He is President & CEO of American Semiconductor, having co-founded the company in 2001, and is co-inventor of Silicon-on-Polymer technology. He is a flexible electronics industry advocate committed to the flexible industry's development. He has over 30 years of experience in wafer fabrication, manufacturing and commercialization at M/A-Com, Zilog, Intel, NorTel and General Instrument. Doug has multiple patents for flexible technology and numerous publications. Doug holds engineering degrees from the University of Idaho (MSEE), Boise State University (BSEE) and in management from Texas Tech University (BBA).
American Semiconductor (ASI) has installed the world's first ultra-thin wafer-level Chip Scale Packaging operation and assembly service in Boise, ID in 2019. ASI is the industry leader in flexible integrated circuits as well as a services provider for Flexible-Hybrid-Electronic (FHE) system design and prototype assembly. Standard and custom Semiconductor-on-Polymer (SoP) ICs are available ranging from OPAMPS to complex system-on-chip (SoC) to NFC and BLE. The company supports all aspects of flexible system design and prototype assembly in its advanced FHE Lab in Boise, ID. Visit us at www.americansemi.com.