November 20 - 21, 2019 | Santa Clara Convention Center, CA, USA
Emerging Technologies Applied
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Presentation Title
Masterclass Title
Next Generation 3D Printed Multi-Chip Module
Santa Clara Convention Center, CA, USA
Conference Room G
11:20 - 11:40
Presentation Summary
Parsons is actively working with the DoD to conceptualize a new generation of 3D-printed MCMs building off of the success of the first generation of HERCULES, presented at IDTechEx last year. The updated HERCULES module is poised to be a core architectural building block for the DoD. We will discuss the extensive ink qualification process that Parsons underwent to determine the optimal material set for chip-scale 3D printed electronics solutions, and early results of accelerated life testing for printed constructions at 40um scale.
Company Profile
Parsons (NYSE:PSN) is a leading disruptive technology provider for the future of global defense, intelligence and critical infrastructure across cybersecurity and intelligence, missile defense, space, connected communities and physical infrastructure. Please visit parsons.com and follow us on LinkedIn and Twitter to learn how we're making an impact.
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