Multi-Material Printing Of UV-Curable And Nano-Composites Using Piezo Inkjet Heads
Santa Clara Convention Center, CA, USA
Grand Ballroom C
16:50 - 17:10
Developed materials and a corresponding method of printing electrical conduits, while at the same time printing a 3D structure. Will be showing multi-material printing technology of highly conductive ink with low sintering temperatures and UV curable resins with different material properties to create objects both flexible and stiff.
Dr. Daniel Slep serves as chief technology officer for ChemCubed. Dan's background includes leading manufacturing, research and product development. In these positions, Dan has worked with multiple companies from startups to fortune 500s. Dan currently has an appointment as Adjunct Professor in the Department of Materials Sciences & Engineering at the State University of New York. He is also currently serving on the External Advisory Board for Chemical Engineering at Stony Brook University and lectures about topics such as Additive Manufacturing, Polymer Engineering and Nanotechnology. Dan's education includes a bachelor's degree in physics, as well as a master's degree and Doctor of Philosophy in material sciences. During his more than two decades in the printing Industry, Dan has published industry-related articles and scientific papers and is the inventor of multiple patents.
ChemCubed (Chem3) develops custom chemistries, for piezo-head Additive Manufacturing (AM); nano-composite materials for jetting by means of common, commercial piezo-effect inkjet "additive process" 3-D printing equipment. These jettable nano-composite materials are application specific, embodying customer-specified physical, electrical, thermal and mechanical properties.
Chemcubed has developed a corresponding multi-material printing technology: printing electrical conduits and at the same time printing a 3D structure. The ElectroUV3D printers, allow users to effortlessly print highly conductive liquids, support and insulating materials; creating objects with flexible and stiff, as well as conductive properties all at one time and also prints on FR4 boards or on Kapton ® for flexible electronics.