In many cases, the development and deployment of Flexible Hybrid Electronics is limited by the constraints of currently available material sets and their compatibility with existing manufacturing processes and equipment. Panasonic Electronic Materials is developing a set of FHE materials based on a unique stretchable thermosetting polymer technology which exhibits very high temperature resistance and ultra-low hysteresis. Using these materials and conventional high-volume fabrication processes, single sided, double sided and multilayer stretchable/compliant circuits have been manufactured. Additionally, copper structures can be selectively formed enabling surface mount component assembly with conventional reflow solder materials and processes.
Speaker Biography (Andy Behr)
Andy Behr is a Technology Manager with Panasonic Electronic Materials. He leads a Silicon Valley based research and marketing team responsible for developing and launching leading-edge materials. His team also conducts technology scouting which involves "triangulating" strategic level market demands, business drivers and technology advancements to anticipate unmet needs for enabling materials. Andy holds an undergraduate biology degree and an MBA. He has more than twenty years of experience in material technologies such as photoresists, adhesives, encapsulants, conductive materials, fluoro-chemicals, abrasives, films and tapes. Andy began his career in research and has subsequently held positions in marketing and leadership.
Company Profile (Panasonic)
Panasonic Corporation is a worldwide leader in the development of diverse electronics technologies and solutions. Since its founding in 1918, the company has expanded globally and now operates 474 subsidiaries and 94 associated companies worldwide, recording consolidated net annual sales of 7.553 trillion yen. Committed to pursuing new value through innovation across divisional lines, the company uses its technologies to create a better life and a better world for its customers. Panasonic Electronic Materials Division provides high performance circuit board laminates, advanced films, molding compounds and semiconductor encapsulation materials to global electronics manufacturing customers.