Conference Downloads
For those of you who have purchased the audio proceedings these too are available for download.
If you have any problems please contact Laura Roberts at l.roberts@idtechex.com
Day 1 and 2 PDF Presentations and Audio |
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| PDF Presentations | 300 Mb |  |
Audio Presentations | 300 Mb |
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Masterclasses |
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Masterclasses |
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| Masterclass 1 | 7 Mb |
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Masterclass 7 | 6 Mb | |
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| Masterclass 2 | 7 Mb |
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Masterclass 8 | 17 Mb | |
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| Masterclass 3 | 17 Mb |
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Masterclass 9 | 8 Mb | |
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| Masterclass 4 | 11 Mb |
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Masterclass 10 | 6 Mb | |
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| Masterclass 5 | 18 Mb |
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Masterclass 11 | 8 Mb | |
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| Masterclass 6 | 5 Mb |
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To access FTP details: please logon to our website with your IDTechEx login, than open new tab in your browser and paste the links above, that will give you the FTP access details.
Individual Presentations - please click on speaker/company names in the list below the table.
Tuesday, 13 Apr 2010
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Wednesday, 14 Apr 2010
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Wednesday April 14, 2010
Barrier Materials (12:05 - 14:50)
12:05 - 12:30 "Development of High Barrier Films for Flexible PV and OLED Applications"
- 3M is developing flexible encapsulation systems suitable for display and solid state lighting applications. Our transparent barrier films are made using an all vacuum web process on polyester (PET and PEN) substrates. Our initial product offerings have water vapor transport rates (WVTR) below 0.005 g/m2-day and are primarily intended for the e-paper and screen printed OLED markets. Next generation products will address the OLED handheld display and solid state lighting markets. These markets will need WVTR films in the 10-4 to 10-6 range.
- We will present data showing that these low WVTRs can be achieved with 3M's technology. Pressure sensitive adhesives with good barrier properties (2-4 g/m2-day for 1 mil adhesives films) have been developed for use with our barrier films. 3M barrier films and adhesives are available in roll and sheet form. They provide a versatile encapsulation system for rigid and flexible devices that can incorporate value added features such as hard coat, anti reflection, UV cut, and light extraction functions.
12:30 LUNCH
- With its partners from the Fast2Light consortium, Holst Center/TNO and Philips Research Laboratories, Huntsman develops device encapsulation technology protecting OLEDs from environmental impacts, providing prolonged lifetime and enabling fexible OLED lighting.
- This is achieved by thin film encapsulation stacks based on alternating organic/inorganic layers for which Huntsman is developing the organic materials.
- This presentation deals with various aspects of defects in OLED's created by water vapor transmission and it's impact on final thin-film encapsulation TFE specification.
- Flexible sealants with Low water vapor transmission rate
- Applications in Printed Electronics
- Optically clear adhesives for touch panel bonding or window lamination
Europe's leading event on printed electronics
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