Photonic Delamination Of Polyimide Films For Display Applications
Santa Clara Convention Center, CA, USA
Grand Ballroom H
12:20 - 12:40
Over the past few years, NovaCentrix has developed a laser-less technique to delaminated polyimide films from rigid carrier substrates by using the PulseForge tools. The process involves non-equilibrium heating of the polyimide surface while the device stack temperature remains below 100°C. As OLED and AMOLED displays gain volume in the consumer electronics market, the photonic delamination can reduce the delamination cost by replacing expensive laser systems. Additionally, the PulseForge systems can illuminate large areas at once, leading to processing rates significantly higher than point or line laser systems. Lastly, the device stack is protected and will not be illuminated through the photonic delamination process. This reduces defect formation due to impurities in the polyimide layer and leads to significant improvement in the yield of the delamination process. Laser delamination presents a bottleneck in OLED production while photonic delamination presents a novel technique to overcome the stated barriers.
NovaCentrix is focused on technologies and materials to enable manufacturing in Printed Electronics. The PulseForge® photonic curing tools process high-temperature materials on low-temperature substrates. Applications include drying, sintering, annealing, or reacting metallic, non-metallic, and semiconductor inks, without damaging temperature sensitive substrates such as foils and plastics.