Previous Speakers

Traditional electronic systems have historically been the packaging of packaged components, modules, and printed circuit boards (PCBs). We design the box then fill the box with electronics. With the emergence of advanced materials, 3D printing technologies and printed electronics a new paradigm in electronic packaging exists where the box is the electronics, the UAV is the electronics or the structure is the electronics. One issue however, testing and qualification of structural electronics still needs to be defined. Mechanical testing of structures is not the same test when testing electronics. To some structural engineers, embedding electronics is the same as embedding defects. So understanding performance will be extremely important. This presentation will cover what's been done, what are the challenges and the opportunities ahead for the market place as well as opportunities for the pre-college student that will become our future engineers, designers and artists.

C. Mike Newton has over 30 years' experience in the areas of advanced microelectronics and Microsystems technologies. He has built and managed a number of fabrication and research labs serving both commercial and more recently government markets. He has scaled up ceramic microelectronic products for both the commercial and military industries. Currently, he is co-founder and CEO of Newton Cyberfacturing Inc. based in Orlando. The company is focused on 3D printed circuit structure (PCS) manufacturing of components, subsystems and platforms serving the Military, Medical and commercial electronics industry. He also serves as Director of Strategic Technology at Sciperio Inc. developing technology transition opportunities into the 3D structural and printed electronics market space for functional device fabrication. Prior to joining Sciperio, he served as Chief Technologist - Microsystems with the Microelectronic Core Technology Group at Harris Corporation. In this position, he led strategic technology pursuits into the DoD, National Labs and DARPA. He currently has over 42 patents in microelectronics, sensors, ceramic structures, MEMS and antenna technologies. He has written and presented on the topics of advanced packaging and 3D printed electronics and served as the General Chair of the 3D and conformable Printed Electronics Workshop sponsored by the International Microelectronics and Packaging Society (IMAPS). He has also served as session co-chair for the Additive manufacturing & Printed Electronics Session for the IMAPS National Symposium. He has served as the IMAPS Regional Director, Florida Chapter President, the Executive Council Vice President of Technology and currently the VP of Technology and Student Outreach. He is an active mentor on 3D printing supporting STEM/STEAM at Bayside High School, Palm Bay. He serves as Committee Chair for Boy Scout Troop 734 and Venture Crew 740. Most recently he is a committee member of the newly formed Space Coast Tech Council.

Discover Cyberfacturing as the future of manufacturing advanced electronic packaging - digitally based and scalable. Our technology can move from 2D to full 3D fabrication; conformal, flexible or structural. Functionality focus is integrated wireless sensor components, devices and systems that support commercial, medical and DoD markets....... We transform printed circuit boards to printed circuit structures.