Advanced FHE touch and sensor demonstrators will be presented. Results integrating fully flexible system-on-chip, flexible high density memory, wireless communication and printed touch technology will be highlighted for wearables, smart labels and smart-structure applications. The presentation includes an update on the state-of-the art for high performance flexible integrated circuits.
Mr. Hackler is an industry leader experienced in engineering, operations, marketing and management. He is President & CEO of American Semiconductor, having co-founded the company in 2001, and is co-inventor of Silicon-on-Polymer technology. He is a flexible electronics industry advocate committed to the flexible industry's development. He has over 30 years of experience in wafer fabrication, manufacturing and commercialization at M/A-Com, Zilog, Intel, NorTel and General Instrument. Doug has multiple patents for flexible technology and numerous publications. Doug holds engineering degrees from the University of Idaho (MSEE), Boise State University (BSEE) and in management from Texas Tech University (BBA).
American Semiconductor is the industry leader in flexible integrated circuits as well as a services provider for Flexible-Hybrid-Electronic (FHE) system design and prototype assembly. Standard and custom Semiconductor-on-Polymer (SoP) ICs are available ranging from OPAMPS to complex system-on-chip (SoC). The company supports all aspects of flexible system design and prototype assembly in its advanced FHE Lab in Boise, ID. Visit us at www.americansemi.com.