Agenda
Wednesday April 29, 2015
3D Printed Electronics (11:15 - 14:30)
11:15 - 11:40 "Micrometer-scale 3D Printing with Aerosol Jet"1. UV light exposure during the printing can substantially cure polymeric materials in-flight and complete the cure immediately on impact.
2. This nearly instantaneous curing allows structures to be built up in three dimensions.
3. Aspect ratios of more than 20:1 are achieved with micrometer-scale posts, cylinders, and cones.
4. With robotic manipulation of the print head and target substrate, the 3D features can be fabricated in nearly any orientation including the fabrication of hollow structures such as microbubbles.
5. Co-depositing electronic and polymeric materials can be used to fabricate hybrid structures.
This presentation outlines 3D Printed Electronics produced using the Aerosol Jet process. The current status for adding electronics functionality from 3D circuits, sensors and antenna through to future applications such as packaging and memory will be reviewed. The state-of-the-art related to production equipment and scalability in mass manufacture will be presented.
Printed circuit boards have been around since the 1920's and have evolved to become a well know solution to the component interconnection problem. Different actors influenced the evolution of PCBs including scientists and engineers, and, as with most technologies, hacking played a major role. As the additive processes to build printed circuit boards make their way into the consumer market and the promises of low-cost and ultra-quick turnaround becomes fulfilled, an interesting range of possibilities are at hand for hackers to re-invent our world. In this presentation we'll present some of the new possibilities of 3D printed circuits given its flexible, light-weight and disposable properties. Some challenges for this new type of boards will be discussed at the end of the presentation.
Solder mask direct deposition on a 3D multicomponent surfaces by Ink jet technology requires overcoming two significant technological gaps -
1. A Formulation meeting both PCB industry requirements (finishing lines, assembly lines, etc.) & Ink jet technology requirements (reliability, jettability, print quality issues).
2. Direct deposition of a single liquid on a multi component surface (hydrophilic & hydrophobic) while controlling dot size, in order to achieve high printing quality.
The presentation will describe the benefits of Gryphon 3D functional inkjet printer for PCB manufacturers, assemblers and end users by overcoming the challenges imposed by traditional solder mask process.
12:55 Lunch