Printed Electronics USA 2008
Printed Electronics USA 2008
 

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Conference Agenda

 

Wednesday, 03 Dec 2008

 The Application of Printed Electronics to Products
09:45Avery Dennison Industrial Products Division
08:55Nokia Research Center
08:30IDTechEx
09:20Structural Graphics
10:10Break
 Radical New Printed Electronics Products
12:20Stora Enso Packaging Boards
11:30Plastic Logic Ltd
10:50Toppan Forms Co Ltd
11:55Kovio
12:45LUNCH

Track 1

 Healthcare and Bionic Man
08:50RF-iT Solutions
14:00University of St Andrews
14:25Toumaz Technology Ltd.
 Thin, Flexible Printed Batteries
14:50Blue Spark Technologies
15:15NEC Corporation
15:40Break
16:20Infinite Power Solutions Inc
16:45Lux Research

Track 2

 Electronics as Art, Signage, Human Interface - Large Area Displays
15:40Break
16:20Acreo AB
14:25E Ink Corporation
14:00Rogers Corporation
14:50TRED Displays
15:15Apple Inc
 Smart Substrates and Stretchable Electronics
16:45University of Cambridge
17:10University of Washington

Track 3

 Thin Film Transistor Circuits - New Possibilities
15:15Northrop Grumman
14:00Epson
14:25PolyIC GmbH & Co KG
14:50Terepac
15:40Break
 Sensors Networks & Actuators
16:20Palo Alto Research Center (PARC)
17:10NXT Technology Inc
16:45University of California

Thursday, 04 Dec 2008

Track 1

 Thin Film and Printed Photovoltaics
08:55Konarka Technologies Inc
08:30Boeing Spectrolab
 PV: Panel Discussion
09:20HelioVolt Corporation
IDTechEx
Lux Research
Boeing Spectrolab
10:10Break
 PV: Nano-Enabled Technologies
11:00University of Washington
11:25Applied Nanotech Inc
 PV: Inorganic Photovoltaic
11:50HelioVolt Corporation
 PV: Organic PV- Organic Concentrators
12:40Lunch
14:50Arizona State University
14:25MIT
14:00Solarmer Energy
12:15Plextronics Inc
15:15Break
 Novel RFID approaches
16:00Friendly Technologies Ltd
 Printed Electronics Standards and Global Progress
16:25OE-A
16:50IDTechEx

Track 2

 Materials:Organic and Inorganic Semiconductors, Dielectrics
08:55Korea Institute of Science and Technology
09:20Faculdade de Ciencias e Tecnologia
08:30BASF Future Business GmbH
 Materials: Carbon Nanotubes and Graphene
09:45EIKOS
10:10Break
11:00Rutgers University
 Materials: Conductive Materials
11:25NanoMas Technologies
11:50Sun Chemical
12:15SSCP CO.
12:40LUNCH
14:00Chisso Petrochemical co.
 Materials: Meta-Materials
14:25Imperial College London
 Materials: Material Scarcity
14:50H.C. Starck Inc
15:15Break
16:00University of Augsburg
 Materials: The Big Need: Barrier/ Encapsulation Materials
16:25Vitex Systems Inc
16:50IDTechEx

Track 3

 Printing:Roll-to-Roll Printed Electronics: Co-Deposition of Components
08:30Soligie
 Printing: Breakthrough in Room Temperature Cure
08:55NovaCentrix Corp
 Printing: Digital Printing Breakthroughs
10:10Break
11:00FUJIFILM Dimatix
09:20Optomec Inc
11:25imaging Technology international (iTi)
09:45Pixdro/OTB
11:50Asahi Kasei Chemicals
12:15RFidium
12:40LUNCH
 Process/Inspection/Testing Systems
14:00Northfield Automation Systems Inc
 Printing: Conformal/Flexible Displays
15:15Break
16:25CDT Limited
14:50Add-Vision
14:25DuPont Displays
16:00AJJER
 
 
 

Thursday December 04, 2008

Materials: The Big Need: Barrier/ Encapsulation Materials (16:25 - 17:10)

Vitex Systems Inc, United States, Dr Robert Jan Visser, CTO
16:25 - 16:50 "Barix multilayer barriers as protection for printed and flexible electronics"
  • Principles and performance of Barix barrier films
  • Application in flexible (OLED) displays
  • Barix Barrier Films for Thin Film Solar Cells
 
IDTechEx, Germany, Susann Reuter, Director
16:50 - 17:10 "Options and analysis of barrier solutions"
 
 
 
America's largest event on printed and thin film electronics. With over 80 exhibitors and more than 800 delegates anticipated - the whole industry will be at this event. Will you?