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Conference Agenda

Wednesday, 03 Dec 2008   The Application of Printed Electronics to Products 09:45 Avery Dennison Industrial Products Division 08:55 Nokia Research Center 08:30 IDTechEx 09:20 Structural Graphics 10:10 Break   Radical New Printed Electronics Products 12:20 Stora Enso Packaging Boards 11:30 Plastic Logic Ltd 10:50 Toppan Forms Co Ltd 11:55 Kovio 12:45 LUNCH Track 1   Healthcare and Bionic Man 08:50 RF-iT Solutions 14:00 University of St Andrews 14:25 Toumaz Technology Ltd.   Thin, Flexible Printed Batteries 14:50 Blue Spark Technologies 15:15 NEC Corporation 15:40 Break 16:20 Infinite Power Solutions Inc 16:45 Lux Research Track 2   Electronics as Art, Signage, Human Interface - Large Area Displays 15:40 Break 16:20 Acreo AB 14:25 E Ink Corporation 14:00 Rogers Corporation 14:50 TRED Displays 15:15 Apple Inc   Smart Substrates and Stretchable Electronics 16:45 University of Cambridge 17:10 University of Washington Track 3   Thin Film Transistor Circuits - New Possibilities 15:15 Northrop Grumman 14:00 Epson 14:25 PolyIC GmbH & Co KG 14:50 Terepac 15:40 Break   Sensors Networks & Actuators 16:20 Palo Alto Research Center (PARC) 17:10 NXT Technology Inc 16:45 University of California

Thursday, 04 Dec 2008 Track 1   Thin Film and Printed Photovoltaics 08:55 Konarka Technologies Inc 08:30 Boeing Spectrolab   PV: Panel Discussion 09:20 HelioVolt Corporation IDTechEx Lux Research Boeing Spectrolab 10:10 Break   PV: Nano-Enabled Technologies 11:00 University of Washington 11:25 Applied Nanotech Inc   PV: Inorganic Photovoltaic 11:50 HelioVolt Corporation   PV: Organic PV- Organic Concentrators 12:40 Lunch 14:50 Arizona State University 14:25 MIT 14:00 Solarmer Energy 12:15 Plextronics Inc 15:15 Break   Novel RFID approaches 16:00 Friendly Technologies Ltd   Printed Electronics Standards and Global Progress 16:25 OE-A 16:50 IDTechEx Track 2   Materials:Organic and Inorganic Semiconductors, Dielectrics 08:55 Korea Institute of Science and Technology 09:20 Faculdade de Ciencias e Tecnologia 08:30 BASF Future Business GmbH   Materials: Carbon Nanotubes and Graphene 09:45 EIKOS 10:10 Break 11:00 Rutgers University   Materials: Conductive Materials 11:25 NanoMas Technologies 11:50 Sun Chemical 12:15 SSCP CO. 12:40 LUNCH 14:00 Chisso Petrochemical co.   Materials: Meta-Materials 14:25 Imperial College London   Materials: Material Scarcity 14:50 H.C. Starck Inc 15:15 Break 16:00 University of Augsburg   Materials: The Big Need: Barrier/ Encapsulation Materials 16:25 Vitex Systems Inc 16:50 IDTechEx Track 3   Printing:Roll-to-Roll Printed Electronics: Co-Deposition of Components 08:30 Soligie   Printing: Breakthrough in Room Temperature Cure 08:55 NovaCentrix Corp   Printing: Digital Printing Breakthroughs 10:10 Break 11:00 FUJIFILM Dimatix 09:20 Optomec Inc 11:25 imaging Technology international (iTi) 09:45 Pixdro/OTB 11:50 Asahi Kasei Chemicals 12:15 RFidium 12:40 LUNCH   Process/Inspection/Testing Systems 14:00 Northfield Automation Systems Inc   Printing: Conformal/Flexible Displays 15:15 Break 16:25 CDT Limited 14:50 Add-Vision 14:25 DuPont Displays 16:00 AJJER

 

 

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Thursday December 04, 2008

PV: Nano-Enabled Technologies (11:00 - 11:50)

University of Washington, United States, Prof Guozhong Cao,

11:00 - 11:25 "Popcorn-Style Dye Sensitized Solar Cells"

• Formation of microsized aggregates of ZnO nanocrystallites or TiO2 nanotubes by means of solution processing.
• Significant enhancement of power conversion efficiency (~300%) through effective light scattering by microsized aggregates while retaining desired specific surface area for dye molecule adsorption.
• Power conversion efficiency higher than 11% is anticipated when the popcorn structure and surface chemistry is successfully optimized.

 

Applied Nanotech Inc, United States, Dr Zvi Yaniv, President/CEO

11:25 - 11:50 "Novel inkjettable copper ink without the need of inert atmosphere and processing temperatures under 100 degrees C"

• inkjettable copper ink comprised of copper nanoparticles
• inkjettability proven with piezo-electric and aerosole jetting demonstrated
• obtained 30 micrometer wide traces with resistivities as low as 3 x 10(-6) ohm-cm.

 

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