Parsons has established a Quick-Reaction Capability (QRC) Center for the rapid design, production, and test of deployable Printed Electronics (PE) solutions. In 2018, our team endeavored to build HERCULES, a printed multi-chip module (MCM) which employs four digital silicon die interconnected by a fifteen-layer 3D-printed redistribution layer with a minimum feature size of 40 microns. In this presentation we will discuss our technology roadmap, and the challenges associated with building our first fully-functional printed MCM.
Kevin Rose is a Microelectronics Engineer with 15 years of experience supporting the DoD and commercial sector. Mr. Rose supports an integrated product team in the development and manufacture of quick-turn microelectronics hardware solutions. Mr. Rose earned a B.S. in Mechanical Engineering from University of Maryland, Baltimore County, a M.S. in Electrical Engineering from Johns Hopkins University, and an MBA from University of Maryland College Park.
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