Quick-Turn 3D Printed Multi-Chip Modules (Printed Electronics USA 2018)

Mr Kevin Rose, Director of Business Development
Parsons
United States
 

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Presentation Summary

Parsons has established a Quick-Reaction Capability (QRC) Center for the rapid design, production, and test of deployable Printed Electronics (PE) solutions. In 2018, our team endeavored to build HERCULES, a printed multi-chip module (MCM) which employs four digital silicon die interconnected by a fifteen-layer 3D-printed redistribution layer with a minimum feature size of 40 microns. In this presentation we will discuss our technology roadmap, and the challenges associated with building our first fully-functional printed MCM.

Speaker Biography (Kevin Rose)

Kevin Rose is a Microelectronics Engineer with 15 years of experience supporting the DoD and commercial sector. Mr. Rose supports an integrated product team in the development and manufacture of quick-turn microelectronics hardware solutions. Mr. Rose earned a B.S. in Mechanical Engineering from University of Maryland, Baltimore County, a M.S. in Electrical Engineering from Johns Hopkins University, and an MBA from University of Maryland College Park.

Company Profile (Parsons)

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Parsons (NYSE:PSN) is a leading disruptive technology provider for the future of global defense, intelligence and critical infrastructure across cybersecurity and intelligence, missile defense, space, connected communities and physical infrastructure. Please visit parsons.com and follow us on LinkedIn and Twitter to learn how we're making an impact.
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