Quick-Turn 3D Printed Multi-Chip Modules (Printed Electronics USA 2018)

Parsons has established a Quick-Reaction Capability (QRC) Center for the rapid design, production, and test of deployable Printed Electronics (PE) solutions. In 2018, our team endeavored to build HERCULES, a printed multi-chip module (MCM) which employs four digital silicon die interconnected by a fifteen-layer 3D-printed redistribution layer with a minimum feature size of 40 microns. In this presentation we will discuss our technology roadmap, and the challenges associated with building our first fully-functional printed MCM.

Kevin Rose is a Microelectronics Engineer with 15 years of experience supporting the DoD and commercial sector. Mr. Rose supports an integrated product team in the development and manufacture of quick-turn microelectronics hardware solutions. Mr. Rose earned a B.S. in Mechanical Engineering from University of Maryland, Baltimore County, a M.S. in Electrical Engineering from Johns Hopkins University, and an MBA from University of Maryland College Park.

We deliver innovative solutions around the globe that make the world safer, healthier, and more connected

 

Founded in 1944, Parsons Corporation --- a digitally enabled solutions provider --- is focused on the defense, security, and infrastructure markets.

 

We are uniquely qualified to deliver cyber/converged security, technology-based intellectual property, and other innovative services to federal, regional, and local government agencies, as well as to private industrial customers worldwide.