Advanced Thermal Management in EV Power Electronics: Thermal Materials and Thermal Architecture Trends

With the migration from Si IGBT to SiC MOSFET led by leading automotive OEMs like VW, Tesla, Hyundai, and BYD, IDTechEx has observed a rise in junction temperature, potentially surpassing 200°C. This presents unprecedented thermal challenges for conventional thermal management solutions. To address these challenges and mitigate overheating issues, leading semiconductor suppliers, tier one suppliers, and automotive OEMs have proposed various strategies. These include transitioning to direct liquid cooling employing a pin-fin structure, using double-sided cooling, replacing solder alloys with silver or copper sintered paste, employing thermal interface materials with high thermal conductivity, and replacing aluminium wire bonds with copper alternatives.
In this webinar, IDTechEx will conduct an analysis of the traditional thermal structure of power modules and identify the trends and changes in thermal structure and materials employed.
The webinar encompasses the following insights:
  • A high-level examination of the conventional thermal framework in EV power electronics alongside projections for future structures
  • Analysis of trends of die-attach and substrate-attach materials
  • Trends in Thermal Interface Materials (TIM) and an assessment of commercially available TIMs tailored for power electronics
  • Comparison of single and double-sided cooling, alongside emerging trends and commercial applications
This webinar shares some of the research from the new IDTechEx report, "Thermal Management for EV Power Electronics 2024-2034: Forecasts, Technologies, Markets, and Trends".