Printed and Flexible Electronics: State of the Industry

Spanning many materials, technologies and potential use cases, the breadth of the printed and flexible electronics industry can seem daunting. Much like its conventional counterparts, circuits made from printed and flexible electronics can be found across all market verticals. Applications range from building integrated photovoltaic panels to car seat occupancy sensors and from electronic skin patches to smart packaging on consumer goods. With so many options, identifying the most promising product-market fit and opportunities for technical innovation can be challenging.
Drawing on IDTechEx's many years of experience tracking developments across the printed/flexible electronics space, including numerous interviews and regular conference attendance, this webinar will provide an update on the state of the industry, and how it is likely to progress.
Dr Matthew Dyson, a Principal Technology Analyst at IDTechEx who covers printed/flexible electronics, will discuss the following topics:
  • An introduction to printed and flexible electronics, including motivating factors
  • Assessment of product-market fit across the application space, including discussion of use cases seeing most commercial traction
  • A selection of recent innovations, spanning materials, components, and manufacturing methods
  • A roadmap for how the industry will develop, spanning both technologies and applications
This webinar is based on the recently released IDTechEx report, "Flexible & Printed Electronics 2023-2033: Forecasts, Technologies, Markets". This outlines innovations, opportunities, and trends across 5 sectors of the printed and flexible electronics market: automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial. Additionally, the report outlines developments across multiple aspects of the printed and flexible electronics market: 6 distinct manufacturing modalities (including in-mold electronics and flexible hybrid electronics), 5 material types (including conductive inks and component attachment materials), and 4 component types (including flexible ICs).


Dr Matthew Dyson
Dr Matthew Dyson
Principal Technology Analyst