Dr John Heitzinger, President
Avr 04, 2012.
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• Successful implementation of Additive Manufacturing of Electronics (AME), which includes printing and other additive methods of production, starts with a detailed understanding of customer needs and translating those into product specifications.
• Analysis of the available technologies and manufacturing approaches results in the determination of a realistic path for product development and production.
• Examples showing where AME is capable of meeting requirements and where it falls short will be discussed.
• Success can often be achieved by combining AME with traditional electronics.
Speaker Biography (John M. Heitzinger)
John is a veteran of the semiconductor and electronics industries with broad experience in research and development, technical management, customer service, product management and business leadership. He has worked closely with organizations in Asia, Europe and North America taking new products and processes from concept to high volume manufacturing. John's education includes B.S. degrees in chemistry and physics and a Ph.D. in chemistry.
Company Profile (Soligie)
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Soligie is the leading company to utilize high speed manufacturing to produce printed electronics with a variety of conductive, resistive and proprietary materials on flexible substrates such as PET, paper and foil. State of-the-art design and development capabilities enable customers to realize products that push traditional boundaries. Soligie engages in development projects from the product concept phase through high volume manufacturing. The Company is on the cutting edge of the production of electronic components using high speed, fully additive roll-to-roll processes. Soligie offers a full range of services from concept design, circuit design, design for manufacturability and final volume production. Soligie currently serves the medical device, smart packaging, RFID and flexible interconnect markets. Through the combined use of emergent materials and proprietary manufacturing processes, electronics components such as memory, sensors, displays and batteries will soon be integrated into applications on thin flexible substrates.