Le marché de l'électronique imprimée et flexible devrait atteindre 12 milliards de dollars américains d'ici 2033.

Électronique flexible et imprimée 2023-2033 : prévisions, technologies, marchés

Évaluation des marchés de l'électronique souple et imprimée, couvrant les emballages intelligents, les capteurs imprimés/flexibles, les textiles électroniques, les encres conductrices, les technologies portables, l'électronique hybride flexible, l'électronique 3D, l'électronique intégrée au moule, etc.

Show All Description Contents, Table & Figures List Pricing Related Content
'Flexible & Printed Electronics 2023-2033: Forecasts, Technologies, Markets' explores and evaluates the trends and innovations across this emerging approach to electronics. By summarizing IDTechEx's extensive printed/flexible electronics report portfolio, and drawing on years of following this developing industry, the report outlines innovations, opportunities, and trends across 5 sectors of the printed and flexible electronics market: automotive, consumer goods, energy, healthcare/wellness, and infrastructure/buildings/industrial. This analysis includes granular forecasts of 50 distinct applications.
Additionally, the report outlines developments across multiple aspects of the printed and flexible electronics market: 6 distinct manufacturing modalities (including in-mold electronics and flexible hybrid electronics), 5 material types (including conductive inks and component attachment materials) and 4 component types (including flexible ICs). Multiple examples showing technology development directions and successful commercialization are provided, along with assessments of technological and commercial readiness. Additional forecasts for manufacturing methods and conductive inks are also provided.
Motivation for printed/flexible electronics
Conventional electronics manufacturing, in which copper laminate is selectively etched to leave conductive traces on a PCB (printed circuit board), is a well-established and ubiquitous technology. So why is printed/flexible electronics needed?
Arguably the main benefits are the flexible (and potentially stretchable) form factor combined with the ability to produce large areas. While flexible PCBs using etched copper laminate on a polyimide substrate are an established approach, components are often mounted on 'rigid islands' using standard sheet-to-sheet methods.
Application opportunities
As with conventional PCBs, printed and flexible electronics finds applications in many market verticals. The report forecasts the market for each of 5 verticals, with further segmentation by specific application. Illustrative examples showcase the most commercially promising and innovative applications, while the status and prospects of the underlying applications are illustrated.
The flexibility and stretchability of printed/flexible electronics makes the technology extremely well suited to wearable applications. Electronics skin patches utilizing conductive inks for electrodes and contacts are already available, as are printed pressure sensitive insoles for gait monitoring.
Another application sector seeing extensive traction is automotive interiors, which is increasingly regarded as an opportunity for differentiation. Printed/flexible electronics is well suited to producing large area, conformal functionality to enable integrated touch sensing, heating, and lighting.
Improving sustainability is of course a driver for many emerging technologies, and printed electronics is not different. After some challenging years organic photovoltaics is seeing a renaissance, with
Topics included within the 'Flexible & Printed Electronics 2023-2033: Forecasts, Technologies, Markets'. Source IDTechEx
Manufacturing methods
The benefits of printed/flexible electronics go beyond enabling new applications. It is a fundamentally different approach to manufacturing, replacing subtractive removal of laminated copper with additive deposition of conductive ink. This reduces waste and facilitates digital manufacturing with the associated benefits of rapid prototyping and straightforward design adjustments.
The report evaluates a range of manufacturing innovations and their prospects, ranging from fully additive 3D electronics to in-mold electronics and emerging digital printing methods. This includes notable examples, benefits and challenges, and
Material innovations
Material innovations underpin many emerging hardware technologies, and printed electronics is no exception. Conductive inks underpin the technology, with dozens of companies developing inks with a range of compositions and attributes. Viscous silver-flake based ink for screen printing dominates, but alternatives such as nano-particle and particle-free inks are gaining traction for specific applications such as EMI shielding. An especially notable trend is the development of copper ink, which promises a substantial cost reduction over its silver counterparts. This has long been an aspiration, but technical developments have largely resolved difficulties with oxidation leaving copper inks on the verge of commercial adoption.
Other specialty materials also play an important role in enabling printed/flexible electronics. For example, emerging component attachment materials such as ultra-low temperature solder and field-aligned anisotropic conductive adhesives enable components such as LEDs to be securely attached to cheaper, thermally fragile substrates. Furthermore, many sensors require specialist materials, such as printable piezoelectric polymers for vibration sensing and functionalized carbon nanotubes for ion detection.
Flexible components
While the original vision for printed and flexible electronics was to print every aspect of the circuit, including the integrated circuit, this has largely been supplanted by flexible hybrid electronics (FHE). This approach accepts that printed logic will struggle to compete with silicon, instead aiming for the 'best of both worlds' by printing conductive traces and potentially components such as sensors while mounting integrated circuits.
Of course, mounting rigid components compromises the thin-film flexible form factor to some extent, especially for larger components. As such, there is an opportunity for flexible ICs, batteries, displays and even some sensors that are manufactured independently and then mounted onto flexible substrates.
As with much of the functionality within flexible electronics, the emphasis is generally on achieving a flexible form factor, reducing costs, and improving sustainability rather than optimizing conventional performance metrics. For example, flexible metal oxide ICs can help reduce the costs of RFID tags, and in the future add more functionality for smart packaging applications.
Building on expertise
IDTechEx has been researching developments in the printed and flexible electronics market for well over a decade. Since then, we have stayed close to technical and commercial developments, interviewing key players worldwide, annually attending conferences such as FLEX and LOPEC, delivering multiple consulting projects, and running classes/ workshops on the topic. 'Flexible & Printed Electronics 2023-2033: Technologies, Markets, Forecasts' utilizes this experience and expertise to summarize IDTechEx's knowledge and insight across the entire field.
Report MetricsDetails
Historic Data2021 - 2022
CAGRThe global market for printed flexible electronics, excluding OLEDs, is projected to reach $12 Billion by 2033, a CAGR of 10%.
Forecast Period2023 - 2033
Forecast UnitsVolume (area, m^2) and revenue (USD).
Regions CoveredWorldwide
Segments CoveredApplications (automotive, consumer goods, energy, healthcare/wellness, infrastructure/buildings/industrial), further subdivided by individual applications. Forecasts for manufacturing methods and conductive inks are also included.
Analyst access from IDTechEx
All report purchases include up to 30 minutes telephone time with an expert analyst who will help you link key findings in the report to the business issues you're addressing. This needs to be used within three months of purchasing the report.
Further information
If you have any questions about this report, please do not hesitate to contact our report team at research@IDTechEx.com or call one of our sales managers:

AMERICAS (USA): +1 617 577 7890
ASIA (Japan): +81 3 3216 7209
EUROPE (UK) +44 1223 812300
Table of Contents
1.1.Printed/flexible electronics: Analyst viewpoint (I)
1.2.Printed/flexible electronics: Analyst viewpoint (II)
1.3.What is printed/flexible electronics?
1.4.Motivation for printed/flexible electronics
1.5.Printed/flexible electronics and the hype curve: progressing towards product market fit
1.6.Segmenting the printed/flexible electronics industry landscape
1.7.Printed/flexible electronics in automotive applications: Overview
1.8.Overview: Printed/flexible electronics in consumer goods
1.9.Overview: Printed/flexible electronics in the energy sector
1.10.Overview: Printed/flexible electronics in healthcare / wellness
1.11.Overview: Printed/flexible electronics in infrastructure / buildings / industrial
1.12.Printed/flexible electronics area forecast by application sector (2023, 2028, 2033)
1.13.Printed/flexible electronics area forecast by application sector: 2021 - 2033
1.14.Printed/flexible electronics revenue forecast by application sector (2023, 2028, 2033)
1.15.Printed/flexible electronics revenue forecast by application sector (2023, 2028, 2033)
1.16.Manufacturing methods for printed/flexible electronics: Overview
1.17.Printed electronics is additive, but can be analogue or digital
1.18.Comparison of printing methods: Resolution vs throughput
1.19.Overall forecast: Analogue printing methods
1.20.Overall forecast: Digital printing methods
1.21.Manufacturing methods for printed/flexible electronics: Key conclusions
1.22.Materials for printed/flexible electronics: Overview
1.23.Overall forecast: Conductive ink volume (segmented by ink type)
1.24.Overall forecast: Conductive ink revenue (segmented by ink type)
1.25.Materials for printed/flexible electronics: Key conclusions
1.26.Components for printed/flexible electronics: Overview
1.27.Components for printed/flexible electronics: Key conclusions
2.1.What is printed/flexible electronics?
2.2.Motivation for printed/flexible electronics (I)
2.3.Printed/flexible electronics and the hype curve: progressing towards product market fit
2.4.Engagement with printed/flexible electronics from the wider electronics industry
2.5.Macro-trends driving printed/flexible electronics: Increased use of AI / machine learning for continuous monitoring
2.6.Macro-trends driving printed/flexible electronics: Desire for differentiation and customization
2.7.Macro-trends driving printed/flexible electronics: Importance of sustainability
2.8.Macro-trends driving printed/flexible electronics: Transition towards ambient computing
3.1.1.Market forecasting methodology: Applications
3.1.2.Market forecasting methodology: Materials, components and manufacturing methods
3.1.3.Printed/flexible electronics area forecast by application sector (2023, 2028, 2033)
3.1.4.Printed/flexible electronics area forecast by application sector: 2021 - 2033
3.1.5.Printed/flexible electronics revenue forecast by application sector (2023, 2028, 2033)
3.1.6.Printed/flexible electronics revenue forecast by application sector (2023, 2028, 2033)
3.2.Market forecasts: Application sectors
3.2.1.Automotive applications of printed/flexible electronics by area (thousand m2)
3.2.2.Automotive applications of printed/flexible electronics by revenue (USD millions)
3.2.3.Consumer goods applications of printed/flexible electronics by area (thousand m2)
3.2.4.Consumer goods applications of printed/flexible electronics by revenue (USD millions)
3.2.5.Energy applications of printed/flexible electronics by area (thousand m2)
3.2.6.Energy applications of printed/flexible electronics by revenue (USD millions)
3.2.7.Healthcare/wellness/apparel applications of printed/flexible electronics by area (thousand m2)
3.2.8.Healthcare/wellness applications of printed/flexible electronics by revenue (USD millions)
3.2.9.Infrastructure/buildings/industrial applications of printed/flexible electronics by area (thousand m2)
3.2.10.Infrastructure/buildings/industrial applications of printed/flexible electronics by revenue (USD millions)
3.3.Market forecasts: Manufacturing methods
3.3.1.Overall forecast: Analogue printing methods
3.3.2.Overall forecast: Analogue printing methods (proportion)
3.3.3.Overall forecast: Digital printing methods
3.3.4.Overall forecast: Digital printing methods (proportion)
3.4.Market forecasts: Conductive inks
3.4.1.Overall forecast: Conductive ink volume (segmented by ink type)
3.4.2.Overall forecast: Conductive ink revenue (segmented by ink type)
4.1.Introduction to application sectors
4.1.1.Application sectors for printed/flexible electronics
4.2.Application sectors: Automotive
4.2.1.Automotive applications for printed/flexible electronics: Introduction
4.2.2.Industry transitions require new differentiators
4.2.3.Printed/flexible electronics enables cost differentiation and/or cost reduction
4.2.4.Printed/flexible electronics opportunities from car interior trends
4.2.5.Printed electronics for HMI gains commercial traction
4.2.6.Increasing interest in printed heaters for surface heating in vehicles
4.2.7.Automotive transparent antennas enable windows to be functionalized
4.2.8.Printed/flexible electronics for automotive applications: SWOT analysis
4.2.9.Printed/flexible electronics in vehicle interiors: Readiness level assessment
4.2.10.Printed/flexible electronics in vehicle exteriors: Readiness level assessment
4.2.11.Automotive applications for printed/flexible electronics: Conclusions
4.3.Application sectors: Consumer goods
4.3.1.Consumer goods applications for printed/flexible electronics: Introduction
4.3.2.Embedding electronics in natural materials
4.3.3.Electronics on 3D surfaces with extruded conductive paste and inkjet printing
4.3.4.Extruded conductive paste for antennas
4.3.5.Printed RFID antennas struggle for traction: Is copper ink a solution?
4.3.6.Smart packaging with flexible hybrid electronics
4.3.7.OLEDs for smart packaging
4.3.8.Printed/flexible electronics for consumer goods: SWOT analysis
4.3.9.Consumer goods applications for printed/flexible electronics: Conclusions
4.4.Application sectors: Energy
4.4.1.Energy applications for printed/flexible electronics: Introduction
4.4.2.Conductive pastes for photovoltaics
4.4.3.Flake-based conductive inks face headwind from alternative solar cell connection technology
4.4.4.Organic photovoltaics gains traction
4.4.5.Renaissance of organic photovoltaics (OPV) continues
4.4.6.Perovskite PV shows rapid efficiency gains to be comparable with silicon
4.4.7.Companies aiming to commercialize thin film flexible PV
4.4.8.Thin film perovskite PV roadmap
4.4.9.Printed/flexible electronics for energy: SWOT analysis
4.4.10.Printed/flexible electronics for energy: Conclusions
4.5.Application sectors: Healthcare / wellness
4.5.1.Healthcare/wellness applications for printed/flexible electronics: Introduction
4.5.2.Electrochemical biosensors present a simple sensing mechanism that utilizes printed electronics
4.5.3.Interest in skin patches for continuous biometric monitoring continues
4.5.4.Material suppliers collaboration has enabled large scale trials of wearable skin patches
4.5.5.In-hospital applications remain promising but challenging
4.5.6.E-textiles and wearable sensing aims to overcome washability issues
4.5.7.Progress in using liquid metal alloys as stretchable inks for wearable electronics
4.5.8.Printed pH sensors for biological fluids
4.5.9.Key requirements of wearable electrodes
4.5.10.Increased demand for wearable/medical manufacturing leads to expansion plans
4.5.11.Smart-packaging to improve pharmaceutical compliance
4.5.12.Printed/flexible electronics for healthcare / wellness applications: SWOT analysis
4.5.13.Printed/flexible electronics for healthcare / wellness applications: SWOT analysis (II)
4.5.14.Printed/flexible electronics for healthcare / wellness applications: Readiness level
4.5.15.Printed/flexible electronics for healthcare/wellness applications: Conclusions
4.6.Application sectors: Infrastructure / buildings / industrial
4.6.1.Infrastructure / buildings / industrial applications for printed/flexible electronics: Introduction
4.6.2.Industrial asset tracking/monitoring with hybrid electronics
4.6.3.Capacitive sensors integrated into floors and wall panels
4.6.4.Printed electronics enables cost-effective building and environment sensing
4.6.5.Building integrated transparent antennas and reconfigurable intelligent surfaces
4.6.6.Material choice for passive RIS
4.6.7.Integrated electronics enable industrial monitoring
4.6.8.Integrated electronics promises customizable interiors
4.6.9.Printed/flexible electronics for building / infrastructure / industrial applications: SWOT analysis (I)
4.6.10.Printed/flexible electronics for building / infrastructure / industrial applications: SWOT analysis (II)
4.6.11.Printed/flexible electronics for infrastructure / buildings / industrial applications: Conclusions
5.1.1.Manufacturing methods for printed/flexible electronics: Overview
5.1.2.Printed electronics is additive, but can be analogue or digital
5.1.3.Comparison of printing methods: Resolution vs throughput
5.1.4.Ensuring reliability of printed/flexible electronics is crucial
5.1.5.Digitization in manufacturing facilitates 'printed-electronics-as-a-service'
5.2.Manufacturing methods: 3D electronics electronics: Introduction
5.2.2.Additive electronics and the transition to three dimensions electronics spans multiple length scales
5.2.4.Fully 3D printed electronics process steps
5.2.5.Interest in fully additive electronics continues with new entrant
5.2.6.Advantages of fully additively manufactured 3D electronics electronics: SWOT analysis
5.2.8.Readiness level of additive manufacturing technologies electronics: Conclusions
5.3.Manufacturing methods: Analogue manufacturing
5.3.1.Analogue printing: Introduction
5.3.2.Conventional screen printing companies continue to embrace printed/flexible electronics
5.3.3.Improvements in screen printing resolution
5.3.4.High resolution screen-printing for wrap around electrodes
5.3.5.Cliché-based printing methods
5.3.6.Highs resolutions possible with reverse offset printing
5.3.7.Analogue printing: SWOT analysis
5.3.8.Benchmarking analogue printing methods
5.3.9.Technological and commercial readiness level of analogue printing methods
5.3.10.Summary: Analogue printing methods
5.4.Manufacturing methods: Digital printing
5.4.1.Digital printing: Introduction
5.4.2.Digital printing spans multiple length scales
5.4.3.Benchmarking digital printing methods
5.4.4.Comparing deposition methods
5.4.5.Operating mechanism of laser induced forward transfer (LIFT)
5.4.6.Digital manufacturing continues to gain traction
5.4.7.Innovations in high resolution printing
5.4.8.Increased emphasis on prototyping with additive electronics
5.4.9.Digital printing: SWOT analysis
5.4.10.Digital printing: Readiness levels
5.4.11.Digital printing: Conclusions
5.5.Manufacturing methods: Flexible hybrid electronics
5.5.1.Flexible hybrid electronics: Introduction
5.5.2.FHE takes a 'best of both' approach
5.5.3.Flexible hybrid electronics (FHE)
5.5.4.Comparing benefits of conventional and printed/flexible electronics
5.5.5.FHE value chain: Many materials and technologies
5.5.6.Wearable skin patches - another stretchable ink application
5.5.7.Development from conventional boxed to flexible hybrid electronics will be challenging
5.5.8.Condition monitoring multimodal sensor array
5.5.9.Multi-sensor wireless asset tracking system demonstrates FHE potential
5.5.10.A new contract manufacturer for flexible hybrid electronics (FHE) emerges
5.5.11.Flexible hybrid electronics (FHE): SWOT analysis
5.5.12.Flexible hybrid electronics (FHE): Conclusions
5.6.Manufacturing methods: In-mold electronics
5.6.1.In-mold electronics (IME): Introduction
5.6.2.IME manufacturing process flow
5.6.3.Comparing smart surface manufacturing methods
5.6.4.Segmenting IME manufacturing techniques
5.6.5.Commercial advantages of IME
5.6.6.IME value chain - a development of in-mold decorating (IMD)
5.6.7.IME value chain overview
5.6.8.In-mold electronics without embedded SMD components rapidly gaining traction
5.6.9.Overview of specialist materials for IME
5.6.10.Materials for IME: A portfolio approach
5.6.11.Silver flake-based ink dominates IME
5.6.12.Overview of IME and sustainability
5.6.13.In-mold electronics: SWOT analysis:
5.6.14.Conclusions for the IME industry (I)
5.7.Manufacturing methods: R2R manufacturing
5.7.1.R2R manufacturing: Introduction
5.7.2.Can R2R manufacturing be used for high mix low volume (HMLV)?
5.7.3.What is the main commercial challenge for roll-to-roll manufacturing?
5.7.4.Examples of R2R pilot/production lines for electronics
5.7.5.Commercial printed pressure sensors production via R2R electronics
5.7.6.Emergence of a contract manufacturer for flexible hybrid electronics (FHE)
5.7.7.Applying 'Industry 4.0' to printed electronics with in-line monitoring
5.7.8.Applications of R2R electronics manufacturing
5.7.9.R2R manufacturing: SWOT analysis
5.7.10.R2R manufacturing: Readiness level
5.7.11.R2R manufacturing: Conclusions
6.1.1.Materials for printed/flexible electronics: Overview
6.1.2.Materials supplier commercialization strategies (I)
6.1.3.Materials supplier commercialization strategies (II)
6.2.Materials: Component attachment materials
6.2.1.Component attachment material: Introduction
6.2.2.Differentiating factors amongst component attachment materials
6.2.3.Low temperature solder enables thermally fragile substrates
6.2.4.Comparing electrical component attachment materials
6.2.5.Durable and efficient component attachment is important for FHE circuit development
6.2.6.Field-aligned anisotropic conductive adhesive reaches commercialization
6.2.7.Photonic soldering gains traction
6.2.8.Component attachment materials (for printed/flexible electronics): SWOT analysis
6.2.9.Component attachment materials: Readiness level
6.2.10.Component attachment materials for printed/flexible electronics: Conclusions
6.3.Materials: Conductive inks
6.3.1.Conductive inks: Introduction
6.3.2.Conductivity requirements by application
6.3.3.Challenges of comparing conductive inks
6.3.4.Segmentation of conductive ink technologies
6.3.5.Conductive ink companies segmented by conductive material
6.3.6.Market evolution and new opportunities
6.3.7.What are the key growth markets for conductive inks?
6.3.8.Balancing differentiation and ease of adoption
6.3.9.Interest in novel conductive inks continues
6.3.10.Copper inks gaining traction but not yet widely deployed
6.3.11.Companies continue to develop and market stretchable/thermoformable materials
6.3.12.Conductive inks: SWOT analysis
6.3.13.Conductive inks: Readiness level assessment
6.3.14.Conductive inks: Conclusions
6.4.Materials: Printable semiconductors
6.4.1.Printable semiconducting materials: Introduction
6.4.2.Organic semiconductors: Advantages and disadvantages
6.4.3.Non-fullerene acceptors support OPV renaissance for non-standard applications
6.4.4.Substantial opportunities for OPD and QD materials in hybrid image sensing
6.4.5.Interest in OTFTs continues despite struggles
6.4.6.Printable semiconductors: SWOT analysis
6.4.7.Readiness level of printed semiconductors (organic and perovskite applications)
6.4.8.Printable semiconductors: Conclusions
6.5.Materials: Printable sensing materials
6.5.1.Printable sensing materials: Introduction
6.5.2.Drivers for printed/flexible sensors
6.5.3.Overview of specific printed/flexible sensor types
6.5.4.Polymeric piezoelectric materials receive increasing interest
6.5.5.Sensing for industrial IoT
6.5.6.Sensing for wearables/AR
6.5.7.Companies looking to incorporate printed/ flexible sensors often require a complete solution
6.5.8.Printable sensor materials: SWOT analysis
6.5.9.Printed sensor materials: Readiness level assessment
6.5.10.Printed sensor materials: Conclusions
6.6.Materials and components: Substrates
6.6.1.Substrates for printed/flexible electronics: Introduction
6.6.2.Cost and maximum temperature are correlated
6.6.3.Properties of typical flexible substrates
6.6.4.Comparing stretchable substrates
6.6.5.Thermoset stretchable substrate used in multiple development projects
6.6.6.Paper substrates: Advantages and disadvantages
6.6.7.Substrates: Conclusions
7.1.1.Components for printed/flexible electronics: Overview
7.1.2.Component suppliers collaborate on smart packaging and shelf level marketing
7.1.3.Using a thin film component as a substrate: A cost-reduction strategy
7.2.Components: Electrophoretic / electrochromic displays
7.2.1.Electrophoretic / electrochromic displays: Introduction
7.2.2.Colored E-ink for vehicle exteriors
7.2.3.Electrochromic display architecture
7.2.4.Electrochromic display in packaging
7.2.5.Electrophoretic / electrochromic displays: SWOT analysis
7.2.6.Electrophoretic / electrochromic displays: Readiness level assessment
7.2.7.Electrophoretic / electrochromic displays: Conclusions
7.3.Components: Flexible batteries
7.3.1.Flexible batteries: Introduction
7.3.2.'Thin', 'flexible' and 'printed' are separate properties
7.3.3.Major battery company targets printed/flexible batteries for smart packaging
7.3.4.Printed flexible batteries in development for smart packaging
7.3.5.Technology benchmarking for printed/flexible batteries
7.3.6.Flexible batteries: SWOT analysis
7.3.7.Application roadmap for printed/flexible batteries
7.3.8.Flexible batteries: Conclusions
7.4.Components: Flexible ICs
7.4.1.Flexible ICs: Introduction
7.4.2.Fully printed ICs have struggled to compete with silicon
7.4.3.Current approaches to printed logic
7.4.4.Embedding thinned silicon ICs in polymer
7.4.5.Embedding both thinned ICs and redistribution layer in flexible substrate
7.4.6.Investment into metal oxide ICs continues
7.4.7.Flexible ICs: SWOT analysis
7.4.8.Roadmap for flexible ICs
7.4.9.Flexible ICs: Conclusions
7.5.Components: Flexible PV for energy harvesting
7.5.1.Flexible PV for energy harvesting: Introduction
7.5.2.Epishine is leading the way in solar powered IoT
7.5.3.Exeger's partnerships show promising future of DSSCs
7.5.4.Perovskite PV could be cost-effective alternative for wireless energy harvesting
7.5.5.Saule Technologies: Perovskite PV developer for indoor electronics
7.5.6.Flexible PV for energy harvesting: Readiness level assessment
7.5.7.Flexible PV for energy harvesting: SWOT analysis
7.5.8.Flexible PV for energy harvesting:
8.1.ACI Materials
8.4.C3 Nano
8.14.GE Healthcare
8.23.Liquid Wire
8.24.Nano Dimension
8.32.Sun Chemical
8.40.Ynvisible/Evonik/EpishineContact IDTechEx

Ordering Information

Électronique flexible et imprimée 2023-2033 : prévisions, technologies, marchés

Electronic (1-5 users)
Electronic (6-10 users)
Electronic and 1 Hardcopy (1-5 users)
Electronic and 1 Hardcopy (6-10 users)
Electronic (1-5 users)
Electronic (6-10 users)
Electronic and 1 Hardcopy (1-5 users)
Electronic and 1 Hardcopy (6-10 users)
Electronic (1-5 users)
Electronic (6-10 users)
Electronic and 1 Hardcopy (1-5 users)
Electronic and 1 Hardcopy (6-10 users)
Electronic (1-5 users)
Electronic (6-10 users)
Electronic and 1 Hardcopy (1-5 users)
Electronic and 1 Hardcopy (6-10 users)
Electronic (1-5 users)
Electronic (6-10 users)
Electronic and 1 Hardcopy (1-5 users)
Electronic and 1 Hardcopy (6-10 users)
Click here to enquire about additional licenses.
If you are a reseller/distributor please contact us before ordering.
お問合せ、見積および請求書が必要な方はm.murakoshi@idtechex.com までご連絡ください。

Report Statistics

Slides 314
Companies 40
Forecasts to 2033
ISBN 9781915514714

Preview Content

pdf Document Webinar Slides - EOY 2023
pdf Document Webinar Slides
pdf Document Sample pages

Subscription Enquiry