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Konferenz Agenda
Tuesday, 13 Apr 2010| | Keynote Speakers |
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| 08:45 | Nokia | | 09:35 | Procter & Gamble | | 10:25 | Refreshment Break | | 11:55 | Sharp Laboratories of America | | 12:20 | Stora Enso Packaging Boards | | 11:05 | Plastic Logic GmbH | | 08:30 | IDTechEx | | 10:00 | DARPA MTO | | 12:20 | Ericsson | | 09:10 | TOTAL S.A. - Gas & Power | | 11:30 | ST Ericsson | | 12:45 | LUNCH |
Track 1| | End Users |
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| 14:40 | Electrolux Italia S.p.A | | 15:05 | Kimberly-Clark | | 14:15 | Novalia |
| | Transit |
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| 15:55 | Break | | 16:35 | RATP (Paris Transport) | | 15:30 | Cubic Transportation Systems |
| Track 2| | The E-reader Surge |
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| 14:40 | E Ink Corporation | | 15:05 | Bridgestone Corporation | | 14:15 | iRex Technologies BV |
| | Printed RFID |
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| 15:55 | Refreshment Break | | 16:35 | Sunchon National University | | 15:30 | Seoul National University |
| | Smart Textiles |
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| 17:50 | TNO Holst Center | | 17:25 | National Physical Laboratory | | 17:00 | Ohmatex ApS |
| Track 3| | Inorganic Technologies |
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| 17:25 | Sandia National Laboratories | | 17:50 | Solarion AG | | 16:35 | EMPA | | 17:00 | Q-mo solar AG | | 18:15 | Day 1 Track 3 Ends |
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| Wednesday, 14 Apr 2010Track 1 | Track 2| | CNT & Graphene |
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| 09:20 | Fujitsu Laboratories Ltd | | 09:45 | Canatu Oy | | 10:10 | Refreshment Break |
| | Replacing ITO |
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| 15:15 | Agfa Materials | | 15:40 | Fraunhofer ISC | | 16:05 | Refreshment Break | | 16:45 | Day 2 Track 2 Ends |
| Track 3| | Organic and DSSC Photovoltaics |
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| 10:10 | Refreshment Break | | 10:50 | TU Dresden | | 08:55 | IDTechEx | | 11:40 | Coatema Coating Machinery GmbH | | 09:20 | CSIRO | | 09:45 | Dyesol | | 08:30 | Konkuk University | | 11:15 | Universitat Jaume I |
| | Barrier Materials |
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| 12:05 | 3M Display & Graphics Business Lab | | 12:30 | LUNCH | | 14:25 | DELO Industrial Adhesives | | 14:00 | TNO Holst Center | | Huntsman Advanced Materials Switzerland |
| | Sensors |
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| 15:15 | VTT Technical Research Centre of Finland |
| Track 4| | Memory & Transistors |
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| 09:20 | Toppan Printing Co Ltd | | 09:45 | Nano ePrint Ltd | | 08:55 | HUECK FOLIEN Ges.m.b.H. | | 08:30 | NIST | | 10:10 | Refreshment Break |
| | Printing |
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| 11:15 | Xennia Technology Ltd | | 12:30 | LUNCH | | 15:15 | Technische Universität Darmstadt | | 12:05 | Optomec Inc | | 14:00 | Daetwyler R&D Corp | | 14:50 | Fundacio Privada Cetemmsa | | 10:50 | Flexible Display Roll to Roll Research Center(FDRC) | | 14:25 | Korea Institute of Machinery and Materials | | 11:40 | PixDro b.v. | | 15:40 | MatOx Limited | | 16:05 | Refreshment Break | | 16:45 | Day 2 Track 4 Ends |
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Wednesday April 14, 2010Barrier Materials (12:05 - 14:50)12:05 - 12:30 "Development of High Barrier Films for Flexible PV and OLED Applications"- 3M is developing flexible encapsulation systems suitable for display and solid state lighting applications. Our transparent barrier films are made using an all vacuum web process on polyester (PET and PEN) substrates. Our initial product offerings have water vapor transport rates (WVTR) below 0.005 g/m2-day and are primarily intended for the e-paper and screen printed OLED markets. Next generation products will address the OLED handheld display and solid state lighting markets. These markets will need WVTR films in the 10-4 to 10-6 range.
- We will present data showing that these low WVTRs can be achieved with 3M's technology. Pressure sensitive adhesives with good barrier properties (2-4 g/m2-day for 1 mil adhesives films) have been developed for use with our barrier films. 3M barrier films and adhesives are available in roll and sheet form. They provide a versatile encapsulation system for rigid and flexible devices that can incorporate value added features such as hard coat, anti reflection, UV cut, and light extraction functions.
12:30 LUNCH 14:00 - 14:25 "Thin-Film Encapsulation of OLED Lighting Devices"- With its partners from the Fast2Light consortium, Holst Center/TNO and Philips Research Laboratories, Huntsman develops device encapsulation technology protecting OLEDs from environmental impacts, providing prolonged lifetime and enabling fexible OLED lighting.
- This is achieved by thin film encapsulation stacks based on alternating organic/inorganic layers for which Huntsman is developing the organic materials.
- This presentation deals with various aspects of defects in OLED's created by water vapor transmission and it's impact on final thin-film encapsulation TFE specification.
14:25 - 14:50 "Seal It Tight - Adhesives for E-Readers and OPV"- Flexible sealants with Low water vapor transmission rate
- Applications in Printed Electronics
- Optically clear adhesives for touch panel bonding or window lamination
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