Webinar Thursday 11 February - Advances in Electronics Packaging

IDTechEx are hosting a free webinar on Thursday 11 February 2016.

 

Webinar Title: Advances in Electronics Packaging: Conductive Adhesives and Thermal Interface Materials

Date: Thursday 11 February 2016

Presenter: Rachel Gordon, Technology Analyst, IDTechEx

 

Space is limited - reserve your seat today!

 

There are increasing concerns with the use of tin-lead alloy solders because of health hazards of using lead. New research now aims to determine which materials should be used to replace the estimated 50,000 metric tons of tin-lead solder currently used each year.

 

However, no material can replace tin-lead metal solders in all applications. Depending on the application in question, and whether the solder was used primarily for electrical or thermal conduction, a variety of polymeric thermal interface materials (TIM) or electrically conductive adhesives (ECA) may be suitable.

 

This webinar will discuss the wide range of TIM and ECAs that are commercially available, explaining their chemistry and physical properties. This will be correlated to the advantages and applications of each, explaining the large market share or growing popularity of certain materials.

 

The webinar will also investigate where the semi-conductor packaging market is headed next, including discussions of nano-fillers, finer feature sizes and a wider variety of possible substrates.

 

 

Date: Thursday 11 February 2016

Duration: 30 minutes plus 10 minutes for Q&A

 

 

9:30am (GMT) London

10:30am (GMT+1) Amsterdam, Berlin, Rome

11:30am (GMT+2) Athens, Jerusalem, Moscow

4:30pm (GMT+7) Bangkok

5:30pm (GMT+8) Singapore, Taipei, Beijing

6:30pm (GMT+9) Tokyo, Seoul

8:30pm (GMT+11) Canberra

 

 

 

9:00am (Pacific ST) USA & Canada

10:00am (Mountain ST) USA & Canada

11:00am (Central ST) USA & Canada

12:00noon (Eastern ST) USA & Canada

5:00pm (GMT) London