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Research Articles

by Dr Yu-Han Chang

10 Jan 2024

Advanced Semiconductor Packaging Technology Trends: 2.5D & 3D Insights

Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.
07 Dec 2023

High Performance Computing for Automotive

Computers on wheels. That's how people currently see cars. Practically everything that happens in a vehicle is being monitored and actuated by a microcontroller, from opening windows to calculating the optimal fuel-air mixture for the current torque demand. But the surface has only just been scratched in terms of how much computing power is making its way into vehicles.
21 Nov 2023

6G - Now and the Future

Every decade, a new telecom generation emerges, with 5G currently being commercialized, offering faster data rates, low latency, and enhanced reliability. 6G is characterized by Tbps data rates, microsecond latency, and extensive network dependability.
31 Oct 2023

Evaluating the Emerging Materials Landscape for EMI Shielding

Ensuring that sensitive electronic components are not adversely affected by radiated electromagnetic interference (EMI) is an essential part of circuit design. Where compactness and close component proximity are a priority, such as in smartphones and smartwatches, conventional board-level shielding with metallic enclosures is increasingly being replaced with conformal package-level shielding.
26 Sep 2023

How EMI Shielding is Enabling Compact Electronics

It is no secret that electronic devices are becoming increasingly compact, with greater functionality contained in smaller volumes. As such, increasing efforts are being made to mount integrated circuits (ICs) and other components such as antennas closer together, sometimes within the same semiconductor package.
15 Sep 2023

Advancing Cu-Cu Hybrid Bonding: The Future of Semiconductor Packaging

Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional flip-chip soldering. One prominent advancement in this field is the 3D Cu-Cu Hybrid Bonding technology, which offers a transformative solution. IDTechEx have been closely monitoring the advancements in 2.5D and 3D advanced semiconductor packaging.
11 Aug 2023

Next-Generation RDL Materials in Advanced Semiconductor Packaging

With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system's performance relies heavily on the signaling that happens within the package.
05 Jul 2023

Exploring Materials and Processing for Advanced Semiconductor

This is a data-centric world. The growing amount of data generated in various industries increasingly drives the demand for high-bandwidth computing. Applications such as machine learning and AI require powerful processing capabilities, leading to the need for dense transistor placement on chips and compact interconnection bump pitches in packaging.
09 Jun 2023

Did Walmart's RFID Mandate Successfully Drive RFID Adoption in Retail?

In 2022, Walmart made a momentous announcement that sent ripples through the RFID industry. As the world's leading retailer, Walmart revealed its ambitious plan to expand the utilization of RFID technology beyond retail apparel and encompass other critical retail departments.
15 May 2023

Advanced Semiconductor Packaging: Trends and Growth Drivers

Advanced semiconductor packaging technologies are crucial due to the slowing of Moore's law and rising costs of monolithic Si IC development and manufacturing. Initially, components were individually packaged and integrated at the PCB board level, but as devices become smaller and require higher processing capabilities, component integration needs to be pushed beyond board level.
09 May 2023

Exploring the Growth and Market Breakdown of Passive RFID

The RFID industry is expected to maintain its growth trajectory, with IDTechEx forecasting a market value of US$14 billion in 2023, up from US$12.8 billion in 2022. This market value encompasses various RFID form factors, including labels, cards, fobs, and tags, as well as scanners, software, and services for both active and passive RFID technologies. Among these, the "Passive RFID Tags" segment stands out as the largest, comprising more than half of the total RFID market.
17 Apr 2023

6G's Fusion of Sensing and Communicating

6G is the next generation of wireless technology that promises to go beyond mobile communication and revolutionize how people interact with the world around them. According to IDTechEx's latest 6G research, 6G could be with us in 2028 at the earliest.