Amkor

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2025
14 Aug 2025

Scaling the Silicon: Why GPUs are Leading the AI Data Center Boom

With the rising prevalence of these data centers, the accelerated computing chips needed within them are hot in today's markets. In the market report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts", IDTechEx explores high-performance GPUs used in AI data centers and cloud computing. This article shows the scale of deployments from NVIDIA and AMD for today's AI infrastructure, and highlights technology enablers and challenges of these AI chips.
1 Jul 2025

Thermal Management for Advanced Semiconductor Packaging 2026-2036: Technologies, Markets, and Opportunities

IDTechEx Report: Yulin Wang and Dr Yu-Han Chang
16 May 2025

Nordic Semiconductor

Nordic Semiconductor is a Norwegian fabless semiconductor company specializing in ultra-low-power wireless communication and embedded processing for IoT and a market leader in low-power wireless connectivity solutions. Founded in 1983 as Nordic VLSI, the company is headquartered in Trondheim, Norway.
6 May 2025

Trends in GPUs for AI Data Centers

Innovation map of trends in Graphics Processing Units (GPUs) for AI data centers.
24 Apr 2025

AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts

IDTechEx Report:
2 Apr 2025

Emerging Memory and Storage Technology 2025-2035: Markets, Trends, Forecasts

IDTechEx Report: Dr Shababa Selim
27 Jan 2025

Silicon Photonics and Photonic Integrated Circuits 2025-2035: Technologies, Market, Forecasts

IDTechEx Report: Dr Yu-Han Chang
2024
13 Dec 2024

Hardware for HPC, Data Centers, and AI 2025-2035: Technologies, Markets, Forecasts

IDTechEx Report: Dr Shababa Selim, Dr Yu-Han Chang and Yulin Wang
23 Oct 2024

Materials and Processing for Advanced Semiconductor Packaging 2025-2035: Technologies, Players, Forecasts

IDTechEx Report: Dr Yu-Han Chang
17 Oct 2024

Advanced Semiconductor Packaging 2025-2035: Forecasts, Technologies, Applications

IDTechEx Report: Dr Yu-Han Chang
11 Oct 2024

Chiplet Technology 2025-2035: Technology, Opportunities, Applications

IDTechEx Report: Dr Xiaoxi He and Dr Yu-Han Chang
10 Jul 2024

Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts

IDTechEx Report: Dr Yu-Han Chang
11 Apr 2024

3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets

IDTechEx Report:
16 Feb 2024

Antenna in Package (AiP) for 5G and 6G 2024-2034: Technologies, Trends, Markets

IDTechEx Report: Dr Yu-Han Chang
24 Jan 2024

Low-Loss Materials for 5G and 6G 2024-2034: Markets, Trends, Forecasts

IDTechEx Report: Dr Yu-Han Chang
2023
27 Nov 2023

TSMC (Advanced Semiconductor Packaging)

In the world of advanced semiconductor packaging, where innovation and competition drive the industry forward, various packaging technologies and strategies are shaping the future. Previously, IDTechEx had the opportunity to engage in a conversation about advanced semiconductor packaging with Dr. Cheng-Lin Huang, TSMC Advanced Packaging Department Manager. This dialogue provided valuable insights into the technology and the dynamic landscape of this industry. For further details, please refer below.
6 Sep 2023

EMI Shielding for Electronics 2024-2034: Forecasts, Technologies, Applications

IDTechEx Report: Dr Yu-Han Chang and Yulin Wang
16 Aug 2023

AI Chips for Edge Applications 2024-2034: Artificial Intelligence at the Edge

IDTechEx Report:
2022
18 Oct 2022

5G Market 2023-2033: Technology, Trends, Forecasts, Players

IDTechEx Report: Dr Yu-Han Chang
18 Jul 2022

Amkor — Advanced Semiconductor Packaging

A comprehensive overview of advanced packaging technologies and business strategies at Amkor.
Included are: