TSMC (Advanced Semiconductor Packaging) In the world of advanced semiconductor packaging, where innovation and competition drive the industry forward, various packaging technologies and strategies are shaping the future. Previously, IDTechEx had the opportunity to engage in a conversation about advanced semiconductor packaging with Dr. Cheng-Lin Huang, TSMC Advanced Packaging Department Manager. This dialogue provided valuable insights into the technology and the dynamic landscape of this industry. For further details, please refer below. TSMC (Advanced Semiconductor Packaging)