Printed, Flexible and Organic Electronics

Printed, Flexible and Organic Electronics

Printed Electronics, being thin film silicon or inorganic or organic semiconductors, can be used to form Thin Film Transistor Circuits (TFTCs), such as replacing the functionality of simple silicon chips. TFTCs also employ thin film conductors and dielectrics and the ultimate objective is to make many different components at the same time - such as displays, batteries, sensors, microphones etc using the same materials or at least the same deposition techniques thus saving cost and improving reliability. Some TFTCs will be capable of covering large areas to affordably form electronic billboards, smart shelves and so on. They will be lightweight, rugged and mechanically flexible. Often they will be made by rapid, high-volume reel-to-reel processing even forming a part of regular printing processes for graphics. These circuits will be cheap enough to permit electronics where envisaged silicon chips are always or almost always too expensive, where multiple components and needed, and where silicon is impracticle (e.g. not flexible, brittle, thick etc).
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Printed, Flexible and Organic Electronics
1 Dec 2023

Roadmap of In-Cabin Sensor Adoption and Overview by Automotive OEM

Innovation roadmap for in-cabin sensor adoption with SAE autonomous driving level and an overview of in-cabin sensors by automotive OEM.
1 Dec 2023


The Centre for Process Innovation (CPI) are a not-for-profit organisation leading independent technology innovation, partly funded by the UK government. They bring together academia, businesses, government, and investors to bridge research into the marketplace. This update highlights their latest areas of focus, including their position in the field of 3D electronics.
29 Nov 2023

Printed Piezoresistive Sensors: Applications and Opportunities

This premium article discusses printed piezoresistive sensors and their markets, applications, and opportunities.
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28 Nov 2023


Infi-Tex are a smart sensor company, using proprietary conductive inks to create patented pressure sensitive materials used for switches and sensors that can be printed onto textiles.
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28 Nov 2023

Integrated Deposition Solutions

Integrated Deposition Solutions supply aerosol print technology (marketed as NanoJet) for printed electronics applications. Their high-definition aerosol print systems are suitable for integration with a variety of motion platforms, and are growing in serving microelectronics, biomedical, and industrial segments.
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23 Nov 2023

Scrona AG

Scrona are a Swiss company focusing on multi nozzle electrohydrodynamic (EHD) printhead development, with the aim to simplify the microfabrication process through printing with high precision and high throughput.
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22 Nov 2023

Printed Piezoresistive Sensor Technologies

In this premium article, IDTechEx provides an overview of piezoresistive sensor technology and an update on the ongoing innovations in the field.
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21 Nov 2023

Enjet Inc.

Enjet are a South Korean firm that supply electrohydrodynamic (EHD) printers/coaters. Their high-resolution printing method has been applied in micro-LED display fabrication, and their eNanoJet printer offers a total solution for display repairing.
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21 Nov 2023

Webinar - Flexible and Printed Electronics Progress and Outlook

Friday 1 December 2023 - Following the Money - Enabling Materials (conductive inks, CNTs and graphene); Comparisons of applicable 2D and 3D manufacturing processes; Outlook for key components including sensors, batteries and displays; Market drivers and needs
20 Nov 2023

Webinar - MicroLED Displays: Unveiling the Future of Visual Excellence

Thursday 30 November 2023; MicroLED technologies and manufacturing processes; Values and challenges; MicroLED applications and analysis; Application roadmap; Current development status
20 Nov 2023


Tacterion offer pressure sensing and data acquisition solutions based around their proprietary flexible and stretchable piezoresistive sensor platform, plyon. Their plyon flex sensors are especially well suited to applications in which the sensor material is curved or is deformed during operation since they do not register a signal on bending.
15 Nov 2023

Join Our Upcoming Webinar on Advanced Semiconductor Packaging

Friday 24 November 2023 - Advanced Semiconductor Packaging: Materials, Technology, Market Outlook - Advanced semiconductor packaging markets and their mid-long-term opportunity; Player analysis - the dynamics of advanced semiconductor packaging battleground; Industry barriers: Manufacturing challenges and material requirements; Research direction for Advanced Semiconductor Packaging
7 Nov 2023


Sensitronics develop pressure sensors based on force sensitive resistor (FSR) materials, which are produced by contract screen printing companies around the world.
3 Nov 2023


Loomia are an e-textiles start-up founded in 2014 and based in New York, USA, developing a printable material that can integrate heating, lighting, and sensing functionality into textiles.
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1 Nov 2023


Sensel are a start-up company founded in 2013 and based in the Bay Area in California, USA, offering touch-sensing solutions for the next generation of human machine interface (HMI) technologies.
27 Oct 2023


Peratech is a force-sensing human machine interface (HMI) solutions company, founded in 1996 and inventor/developer of proprietary QTC® (Quantum Tunnelling Composites) materials.
2 Oct 2023

Upcoming Webinar - Trends and Innovations in EMI Shielding

Thursday 12 October - An introduction to EMI shielding for electronics, including the transition from board/enclosure level shielding to package level shielding; How trends in semiconductor packaging such as heterogeneous integration will affect EMI shielding requirements and demand for novel deposition capabilities; Emerging materials for EMI shielding, including particle-free (molecular) conductive inks and MXenes
27 Sep 2023


ISORG are a French company that manufacture screen printed organic photodetectors (OPDs), with a target market of large area fingerprint sensors for mobile and security applications. They are the only company capable of mass producing OPDs.
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26 Sep 2023

How EMI Shielding is Enabling Compact Electronics

It is no secret that electronic devices are becoming increasingly compact, with greater functionality contained in smaller volumes. As such, increasing efforts are being made to mount integrated circuits (ICs) and other components such as antennas closer together, sometimes within the same semiconductor package.
22 Sep 2023

Fraunhofer FEP

Fraunhofer FEP are one of many Fraunhofer institutes across Germany. This profile examines their recent work on image sensors that combine a silicon backplane with an organic light absorbing layer to extend the wavelength detection range into the SWIR region.
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