Printed, Flexible and Organic Electronics

Printed, Flexible and Organic Electronics

Printed Electronics, being thin film silicon or inorganic or organic semiconductors, can be used to form Thin Film Transistor Circuits (TFTCs), such as replacing the functionality of simple silicon chips. TFTCs also employ thin film conductors and dielectrics and the ultimate objective is to make many different components at the same time - such as displays, batteries, sensors, microphones etc using the same materials or at least the same deposition techniques thus saving cost and improving reliability. Some TFTCs will be capable of covering large areas to affordably form electronic billboards, smart shelves and so on. They will be lightweight, rugged and mechanically flexible. Often they will be made by rapid, high-volume reel-to-reel processing even forming a part of regular printing processes for graphics. These circuits will be cheap enough to permit electronics where envisaged silicon chips are always or almost always too expensive, where multiple components and needed, and where silicon is impracticle (e.g. not flexible, brittle, thick etc).
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2024
22 Apr 2024

3D Electronics: Empowering Markets with Greater Integration

3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.
22 Apr 2024

BotFactory

BotFactory offers desktop size equipment for fully printed 3D electronics. This profile provides an update on its progress based on the information gathered at LOPEC 2024.
19 Apr 2024

binder ITZ

binder ITZ is a research center of the binder group supplying circular connectors. This profile focuses on its development of printed electronics on 3D surfaces.
18 Apr 2024

Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC & AI Products

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations. Power efficiency is enhanced through innovative packaging techniques, while Performance benefits from shorter interconnection pitches. Area requirements vary for high-performance chips and 3D integration's smaller z-form factor.
17 Apr 2024

Notion Systems

Notion Systems offer inkjet printing solutions tailored for functional materials, spanning from laboratory-scale to industrial production. This profile provides an update on their current technology capabilities.
15 Apr 2024

Printed Photodetector Technologies and Markets

In this premium article, IDTechEx provides an overview of the technology opportunities and market outlook for printed photodetectors.
Included are:
15 Apr 2024

Akoneer

Akoneer offers laser micromachining systems for various applications. This profile focuses on its Surface Activation Induced by Laser (SSAIL) technology which can be used to metallize 3D surfaces.
12 Apr 2024

IDTechEx Release New Global 3D Electronics Market Report

IDTechEx Research announces the availability of a new report, "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets". This IDTechEx report assesses the competing technologies that will enable PCBs to be replaced with integrated electronics. It covers technologies, materials, and applications of electronics added to 3D surfaces, in-mold electronics (IME), and fully printed 3D electronics.
11 Apr 2024

The Role of Printed Sensors in Mass-Digitization

Integrated sensors digitizing physical interactions are vital in everyday life. From personalized user experiences to warehouse inventory management, data-driven insights are driving demand for smarter sensors — and lots of them.
11 Apr 2024

Hummink

Hummink has developed a prototyping machine that can print extremely fine traces using capillary forces. IDTechEx caught up with the company at LOPEC 2024 to find out more.
11 Apr 2024

3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets

IDTechEx Report:
9 Apr 2024

MicroAcoustiX

MicroAcoustiX are a start-up company developing surface acoustic wave (SAW) technology integrated with microfluidic structures, and they showcased their SAW-based aerosol jet printer at LOPEC 2024.
9 Apr 2024

3D Electronics/Additive Electronics 2024-2034

Forecasts taken from IDTechEx report "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets"
Included are:
8 Apr 2024

Conductive Inks at LOPEC 2024

LOPEC 2024 was held in Munich, Germany, on the 6th and 7th of March 2024. This premium article explores key takeaways from the event, focusing on conductive inks.
Included are:
8 Apr 2024

Printed Temperature Sensors: Technologies and Applications

In this premium article, IDTechEx provides an overview of the technology opportunities and market outlook for printed temperature sensors.
Included are:
5 Apr 2024

Zinergy UK Ltd

Printed battery company based in Cambridge, UK, producing ultra-thin batteries using zinc-manganese dioxide chemistry.
Included are:
5 Apr 2024

Fraunhofer IFAM

Fraunhofer IFAM are an independent research institute based in Europe that focus on adhesive bonding technology and surfaces, and shaping and functional materials. Fraunhofer IFAM operate across seven countries with over 700 employees. IDTechEx spoke with Jan Conen, Functional Printing Project Manager, about their printed piezoelectric and temperature sensor technology at LOPEC 2024.
4 Apr 2024

3D Electronics at LOPEC 2024

IDTechEx recently attended the LOPEC 2024 conference on March 5th-7th 2024. This premium article covers the findings in the 3D Electronics sector, as a subsection of the broader printed electronics industry.
Included are:
3 Apr 2024

Fraunhofer IKTS

The Fraunhofer Institute for Ceramic Technologies and Systems (Fraunhofer IKTS) conduct applied research on high-performance ceramics, including additive manufacturing of ceramics. IDTechEx spoke with Clemens Voigt on their latest magneto resistive sensor array for position detection.
1 Apr 2024

Interlink Electronics

Interlink Electronics are a leading provider of printed electronics, HMI devices, and other sensor solutions. Interlink Electronics pioneered the development of the force sensing resistor (FSR) and couple expertise in hardware and software to design and manufacture complete sensing solutions. IDTechEx caught up with Gene Chen, VP Engineering & Advanced Materials, at LOPEC 2024.