With the introduction of Nvidia's B300 GPU with a thermal design power (TDP) exceeding 1400W along with the significant investments and operating costs of data centers, liquid cooling emerges as an "must-have" for high-end computing hardware.
Data center cooling can be broadly split to air cooling, direct liquid cooling/direct-to-chip (D2C) cooling, and immersion cooling. D2C cooling and immersion cooling can be further split into single-phase and two-phase. Single-phase cooling reply on convection whereas two-phase cooling relies on the latent heat during phase change.
D2C cooling also faces significant challenges, such as erosion corrosion, bacterial growth, leakage, high global warming potential concerns, and many others. Immersion cooling, in contrast, has retrofitting complexity and a storage of expertise at this stage.
In this webinar, IDTechEx will provide an overview of the following:
- Direct-to-chip cooling: An exploration of technical barriers and advantages of single- and two-phase D2C cooling
- Immersion cooling: An examination of single-phase and two-phase immersion and their technical and commercial barriers.
- Coolant comparison and regulations: A comparative analysis of coolants used in liquid cooling systems, including costs, regulatory requirements and operating temperature
- An outline of the data centre cooling value chain, highlighting leading companies and the dynamics of their customer-supplier relationships.
- Microfluidic cooling
- Market size forecast and future opportunities
The webinar aims to provide a comprehensive understanding of the benefits, drawbacks, and adoption barriers associated with different cooling approaches. It will also offer insights into the cooling solution market size, future trends and advancements in data center cooling.