Speakers from the world's largest organisations will share their needs & experiences with many world first announcements. Learn of the requirements and case studies from end users and hear all about the latest innovations from companies across the value chain. In total, hear insights from 250 speakers.
Enabling Technologies - Die Attach And Substrate Technologies For Power Electronics Integrated In Electric Vehicles
Estrel Convention Center, Berlin, Germany
11:40 - 12:00
Within this presentation I give a short technology overview of state-of-the-art die attach and substrate technologies applicable to different power electronics for hybridization and full electric vehicles. For high power applications and more sophisticated real electric vehicle applications I give examples of more exotic materials both for die attach and substrate technologies. I describe strategies for layout, design and choice of suitable material combinations from automotive series production of real products already existent in the field. Examples for electrified water pumps, three-phase inverters for 48 V and high voltage applications, in-wheel electric driving applications, DC-DC converters with wide-bandgap semiconductors for different power levels between few hundreds of Watt up to 200 kWatts are presented. Last I present latest R&D work both for highly efficient power and lighting electronics for next generation electric vehicles.