With the introduction of Nvidia's B200 GPU with a thermal design power (TDP) exceeding 1200W, the introduction of liquid cooling has already started to take off. Supermicro has revealed that by September 2024, it had shipped around 2000 liquid-cooled AI racks to the market, and it had expanded its production capacity to 5000 racks per month, which is expected to result in a massive surge in data center liquid cooling.
Data center cooling can be broadly split into air cooling, direct liquid cooling/direct-to-chip (D2C) cooling, and immersion cooling. D2C cooling and immersion cooling can be further split into single-phase and two-phase. Single-phase cooling relies on convection, whereas two-phase cooling relies on the latent heat during phase change.
D2C cooling also faces significant challenges, such as erosion-corrosion, bacterial growth, leakage, high global warming potential concerns, and many others. Immersion cooling, in contrast, has retrofitting complexity and a storage of expertise at this stage.
In this webinar, IDTechEx will provide an overview of the following:
- Air cooling overview
- Direct-to-chip cooling: An exploration of technical barriers and advantages of single- and two-phase D2C cooling
- Immersion cooling: An examination of single-phase and two-phase immersion and their technical and commercial barriers.
- Coolant comparison and regulations: A comparative analysis of coolants used in liquid cooling systems, including costs, regulatory requirements and operating temperature
- Data center cooling value chain and liquid cooling on the data center facility level
- Cost analysis of data center cooling
- Thermal interface materials: An overview of the critical TIMs in efficient heat transfer within cooling systems
- Market size forecast and future opportunities
The webinar aims to provide a comprehensive understanding of the benefits, drawbacks, and adoption barriers associated with different cooling approaches. It will also offer insights into the cooling solution market size, future trends and advancements in data center cooling.