mmWave electronics: towards AiP (antenna-in-package) technologies
12 June 2020 by Dr Khasha Ghaffarzadeh
Electronic packaging will play an important role in enabling higher frequency - e.g., mmWave - electronics. In particular, as the frequency goes up, the antenna spacing shrinks, the need to have large antenna arrays for gain as well as beam forming purposes increases; and the imperative to cut down transmission loss including by placing components closer together inside a package dramatically grows
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