Gestione termica per i data center 2026-2036: tecnologie, mercati e opportunità

This report covers in-depth technical analysis of different cooling technologies for data centers, including air cooling, single-phase direct-to-chip cooling, two-phase direct-to-chip cooling, single-phase immersion, two-phase immersion, and microfluidic cooling. The report covers historic data from 2022 to 2024 and forecasts the market size (US$) and volume demand (units) for liquid cooling components for the next 10 years (2026-2036). The report also analyses thermal interface material (TIM2 and TIM1/TIM1.5) for data center components and projects their market size and area (m2) demand over the next 10 years. The report is one of the most comprehensive reports in the market, analysing different types of cooling technologies for advanced processors and data center applications. With significant investments in data centers, IDTechEx forecasts that the liquid cooling component market size for data centers will exceed US$4 billion by 2036.

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