Solution Processed Organic Photovoltaics (Printed Electronics Europe 2013)

Dr Marie-Beatrice Madec, OPV Scientist
Solvay Interox
United Kingdom


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Presentation Summary

  • Solvay presentation
  • OPV processing
  • Solution processing and ink design

Speaker Biography (Marie-Beatrice Madec)

Marie-Beatrice Madec is a OPV scientist at Solvay in the Research and Innovation, Functional Organic Material department (R&I-FOM). She joined Solvay two years ago and she is in charge of OPV research carried out in the UK. Her research interest focuses on large area OPV.
She graduated from University of Bordeaux I as a PhD in Physical Chemistry of the Condensed Matter. She holds a MSc in Materials Sciences (specialization Polymers and electronics) and a MSc in Chemical Engineering from the National Superior School of Chemistry and Physics of Bordeaux.
Dr Madec has more than 10 years experience combined in nanotechnologies and organic electronics material processing. She has acquired experience through a diverse and international career combining UK academic research; start up companies and multinational chemical industry. Over the years she has built a strong international academic network. Although her current research concentrates on Organic Photovoltaic, she has also accumulated theoretical and practical experience in formulation and processing of organic LED, thin film transistor for sensor and large area electronics.

Company Profile (Solvay)

Solvay logo
Solvay Specialty Polymers offers more products with more performance than any polymer
company in the world. Solvene® EAP is an electro-active polymer designed for printable
organic electronics. It combines inherent piezoelectric, pyroelectric and ferroelectric properties
with toughness, transparency, flexibility and a high dielectric constant. Inks formulations are
available for a variety of printing techniques, including spin coating, casting, screen printing
and inkjet printing. Its low processing temperature (<140°C), low surface roughness, and ability
to be printed on a wide range of substrates in thicknesses from 50 nm to 100 µm make it an
excellent candidate for this emerging technology.
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