Update
9 Mar 2020

Boeing
At Flex2020 Boeing presented a multi-modal sensor utilizing flexible hybrid electronics.
Full profile interview
6 Mar 2020

CPI
CPI, established in 2004 as the 'Centre for Process Innovation', is a partly UK Government funded technology innovation center. This profile focuses on their work and capabilities in the printed/flexible/novel electronics area, and their applications in smart packaging.
Full profile interview
5 Mar 2020

SysteMECH
SysteMECH have developed a direct die-placement technology to attach thin dies (unpackaged ICs) to flexible substrates. This promises to avoid the damage that can occur to bare dies using typical pick-and-place methods and increase yields.
Full profile interview
2 Mar 2020

NextFlex
NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments who collectively aim to advance U.S. manufacturing of flexible hybrid electronics.
Included are:
26 Feb 2020

Wearables Pivot to Healthcare, Printed Electronics Wins
Healthcare Sensor Innovations 2020, hosted in San Jose on March 17-18, identifies and assesses the opportunities for printed and flexible electronics in healthcare as the technology enables a new wave of medical wearable devices.
Full profile interview
7 Feb 2020

American Semiconductor Inc
American Semiconductor is a company based in Idaho, USA that has developed a process for thinning silicon chips and packaging them within a polymer. This enables flexible, durable silicon ICs, offering processing capability with a flexible form factor.
Full profile interview
31 Jan 2020

NovaCentrix
NovaCentrix has developed photonic curing/sintering, which enables conductive inks and solder to be heated without damaging the substrate. This facilitates printing conductive inks and soldering components onto cheap flexible substrates such as PET rather than requiring expensive temperature-resistant substrates.
External press release
2 Dec 2019

innoLAE 2020: Breakthrough Technologies and New Applications
The 6th Innovations in Large-Area Electronics Conference (innoLAE) returns to the Wellcome Genome Campus Conference Centre, Cambridge, UK on 21-22 January 2020, to deliver a programme highlighting the most innovative and exciting aspects of large-area electronics (LAE) - a new way of making electronics which includes printable, flexible, plastic, organic and bio- electronics.
6 Aug 2019

Soft wearable health monitor uses stretchable electronics
A wireless, wearable monitor built with stretchable electronics could allow comfortable, long-term health monitoring of adults, babies and small children without concern for skin injury or allergic reactions caused by conventional adhesive sensors with conductive gels.
2 May 2019

Air Force partnership advancing wearable sensor technology
Imagine being able to monitor your health quickly, simply, painlessly, and continuously, without complicated equipment or a doctor visit. For athletes or people with health conditions, an immediate physical "status update" would be a great convenience. For the warfighter in the field, it could be the crucial element of a successful mission.
External press release
26 Feb 2019

Skin-worn reader for continuous oxygen monitoring
A reader worn on the skin and working in conjunction with an injected hydrogel sensor for real-time oxygen monitoring in tissue.
6 Sep 2018

Structural Health Monitoring for Transportation: Technologies Explored
In nearly every sector the progression away from "dumb" structural materials is evident.
Background
26 Feb 2018

PARC & UCSD: Saliva sensing mouthguard
A group at PARC have developed an oral biosensor within a mouthguard for sensing in saliva. IDTechEx attended a presentation on this work by David Schwartz at 2018FLEX in Monterey, CA.
Background
19 Feb 2018

Cortera Neurotechnologies/UC Berkeley
Cortera Neurotechnologies are developing "minimally" invasive implants for monitoring the brain. IDTechEx attended a presentation by co-founder and CTO Rikky Muller at 2018FLEX in Monterey, CA.
14 Jun 2017

Optomec teams with Lockheed and GE to secure NextFlex contract award
The project, entitled "Conformal Printing of Conductor and Dielectric Materials onto Complex 3D Surfaces" has a total value on $3.1 million.
Full profile interview
8 Mar 2017

Sensor Films Inc.
Sensor Films Inc. (SFI), started around 2013, is a New York-based advanced manufacturing company that seeks to enable the manufacture of flexible hybrid electronics.
12 May 2016

Development and adoption of flexible hybrid electronics
NextFlex, America's first and only Flexible Hybrid Electronics Manufacturing Institute, announced that it is releasing Project Call 2.0 (PC 2.0)--its call for a second round of proposals for up to $10 million in project funding to further the development and adoption of FHE.