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James Hayward
James Hayward
IDTechEx
+44(0)1223 810266
Email Engagement Manager

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SysteMECH SysteMECH have developed a direct die-placement technology to attach thin dies (unpackaged ICs) to flexible substrates. This promises to avoid the damage that can occur to bare dies using typical pick-and-place methods and increase yields. SysteMECH