Advanced Materials

Turquoise Group is an early-stage Australian company, founded in mid-2023, focussed on the dual production of hydrogen and graphene. IDTechEx spoke to Sam Taubert (CEO & MD).

Innovation map for the assessment of the silver nanowire supply and value chains for conductive inks.

High-Temperature Material Systems Limited (HTMS) is a UK-based company founded in 2021 to provide material technologies to the high-value manufacturing sector in the UK.

Innovation map for conductive ink companies segmented by conductive material and ink composition.

Innovation map overview of applications for conductive inks, with application specific TRL & CRL.

Founded in 2007, Hybrid Air Vehicles (HAV) is a developer of hybrid aircraft for zero-carbon aviation, based in Bedford, UK, specializing in the design and manufacturing of its hybrid aircraft technology.

Thursday 20 June 2024 - Exploring the Transformative Potential of Electromagnetic Metamaterials; A brief introduction to RF (radio frequency) and optical metamaterials, highlighting key market opportunities; Analysis of the emerging usage of metalenses, one of the most exciting applications of optical metamaterials, with important manufacturing processes potential challenges highlighted; Analysis of Reconfigurable Intelligent Surfaces (RIS), the most promising applications of RF metamaterials, with discussion on players, technology roadmap, key case studies, etc; Adoption roadmaps for optical and RF metamaterials; Outlook for the electromagnetic metamaterials market

The conductive inks market will grow to exceed US$6.5 billion by 2034 but remains a highly segmented industry, underpinning both photovoltaics and the emerging field of printed electronics. Taking stock of the different outlooks for the myriad of conductive ink types and the various application areas is a complex task. IDTechEx has tackled this problem by assessing the market for different conductive ink types across 15 application areas and providing granular ten-year market forecasts.

Creating a circular economy is an essential sustainability target for numerous stakeholders in the supply chain: governments, brands, suppliers, and consumers. A key element of this is reducing plastic waste; the OECD estimated that over 350 million metric tonnes of plastic waste was generated globally in 2019

Graphene Composites is a UK based start-up, specializing in the incorporation of graphene into an aerogel composite for a range of applications.

Unconventional Gas Solutions (UGS) is an engineering and design firm based in Houston, US, focusing on designing and fabricating gas separation technology packages.

This premium article discusses copper conductive inks.

2024 has marked the 20th anniversary of the original isolation of graphene, first achieved at the University of Manchester in 2004, prior to the award of the Nobel Prize in Physics in 2010. In the two decades since its isolation, graphene has been the subject of immense hype, labeled as a wonder material with superlative properties capable of enabling society-shifting technologies.

Material innovations underpin many of the exciting applications offered by emerging quantum technologies. IDTechEx's latest report, "Quantum Technology Market 2024-2034: Trends, Players, Forecasts", compares platforms based on superconductors, silicon photonics, alkali vapors, semiconductors, nanomaterials, and more. Each is seeking to enable solutions for quantum computing, sensing, and communications, with various advantages and disadvantages for each method.

IDTechEx attended the National Plastics Expo 2024 in Orlando, Florida, USA between 6th and 10th May 2024. This premium article explores updates on advanced recycling from the event.

In this webinar recording, IDTechEx will cover the potential opportunities of emerging alternative bio-based leather materials.

Thermal management for EV power electronics has long posed significant challenges. The ongoing shift from Si IGBT and SiC MOSFET to potentially GaN HEMT in the future results in higher junction temperatures and increased demand for die-attach materials in EV power modules. In traditional Si IGBT power modules, die-attach materials like Pb95Sn5 and Pb92.5Sn5Ag2.5 struggle to meet reliability requirements for packaging power devices in high-temperature applications due to creep-fatigue concerns.

This webinar recording shares nsights into 2.5D and 3D advanced semiconductor packaging technologies, including current status, existing barriers, future development trend, target markets, and player analysis.

With 3D electronics, bulky PCBs can be replaced, resulting in sleek and integrated designs. The automotive industry is one of the largest sectors benefiting from this technology, as electronics can be printed in a thin layer onto surfaces or integrated within components, which can be particularly useful for human-machine interfaces (HMIs).

Telstar is a Spanish company that provides engineering and construction services. It offers helium leak testing and helium recycling solutions for industrial manufacturers.