Western Michigan University
Western Michigan University
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The Center for the Advancement of Printed Electronics is located in the College of Engineering and Applied Sciences at Western Michigan University, in Kalamazoo, MI. The center contains laboratory and pilot scale flexo, gravure, inkjet and screen printing equipment, a full equipped electronic testing lab and materials characterization equipment. The center provides fee for service testing and is actively engaged in industrial research. CAPE's research is focused on the development and application of materials for the fabrication of flexible electronic devices. Examples of some of the printed flexible electronic devices produced within the center include sensors, organic photovoltaics, intelligent packaging, RFID devices and flexible displays.
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2023
17 Jul 2023
Flexible Hybrid Electronics 2024-2034
IDTechEx Report:
5 Jun 2023
Flexible & Printed Electronics 2023-2033: Forecasts, Technologies, Markets
IDTechEx Report:
20 Mar 2023
TemperPack
TemperPack is a packaging manufacturer that provides thermal packaging for perishable goods based on starch foam.2022
17 Nov 2022
Conductive Ink Market 2023-2033
IDTechEx Report:
2021
9 Sep 2021
Printed and Flexible Sensors 2022-2032: Technologies, Players, Markets
IDTechEx Report:
2020
9 Mar 2020
Boeing
At Flex2020 Boeing presented a multi-modal sensor utilizing flexible hybrid electronics.2019
13 Aug 2019
Advanced Wound Care Technologies 2020-2030
IDTechEx Report: Dr Nadia Tsao
2016
2 Mar 2016
NextFlex America's flexible hybrid electronics manufacturing institute
NextFlex, America's Flexible Hybrid Electronics Manufacturing Institute, has officially welcomed its founding members.2015
6 Mar 2015
2015 FLEXTECH Conference
March 5, 2015 - San Jose, Calif. - 2015FLEX, the Flexible & Printed Electronics Conference & Exhibition, successfully revealed the market pull for flexible electronics through keynote plenaries and focused technical sessions, while exhibits on the show floor attracted numerous end users. Held on February 23-26, 2015 - and for the first time at the Monterey, Calif. Conference Center - 580+ registrants saw first-hand demonstrations of end products, as well as new manufacturing tools and materials. The Flex Conference is sponsored annually by FlexTech Alliance.2013
13 Nov 2013
The story behind the world's first large-scale R2R pulsed light sinter
At this year's Printed Electronics USA show in Santa Clara, XENON Corporation is featuring a breakthrough in PE technology: a live demonstration of the SINTERON™ 5000, the world's first large-scale R2R pulsed light sintering system.30 Oct 2013
See How to Print Electronics - Live at Printed Electronics USA
The world's biggest event on Printed Electronics - the IDTechEx Printed Electronics USA 2013 show held in Santa Clara, Ca on Nov 20-21 - will feature "Manufacturing Street" - a live, multi-technology, printed electronics demonstration www.PrintedElectronicsUSA.com.3 Sep 2013
Building Electronics on Paper - Workshop by the Flextech Alliance
IDTechEx analysts attended a workshop on paper electronics held at the Centre for Advancement of Printed Electronics. Some key points and highlighted are briefly summarised in this article.14 Jan 2013
VTT Technical Research Centre of Finland
inert atmosphere printing line, hot embossing, metal evaporation, laser ablation, sintering. Typical web width is 300 mm.
The CPI works on all types of applications, not just a few like OLED and transistors. This means they are able to adapt to a greater range of customers.
2010
18 Oct 2010
Flextech Alliance awards grant to Corning Incorporated
Flextech Alliance awards grant to Corning Incorporated to develop commercially viable methods for continuous printed electronic manufacturing on flexible glass substrates.2009
27 Nov 2009
Western Michigan University and Daetwyler progress Gravure Printing
Western Michigan University and Daetwyler R&D Corporation partnership. The AccuPress printing system is Daetwyler R&D's high-precision gravure press for the printing of sheet-fed, layer-to-layer applications. The unit includes many features to maintain the high-accuracy required for printed electronics uses. The unit is scheduled to be delivered to WMU in April of 2010.