Western Michigan University

Western Michigan University

The Center for the Advancement of Printed Electronics is located in the College of Engineering and Applied Sciences at Western Michigan University, in Kalamazoo, MI. The center contains laboratory and pilot scale flexo, gravure, inkjet and screen printing equipment, a full equipped electronic testing lab and materials characterization equipment. The center provides fee for service testing and is actively engaged in industrial research. CAPE's research is focused on the development and application of materials for the fabrication of flexible electronic devices. Examples of some of the printed flexible electronic devices produced within the center include sensors, organic photovoltaics, intelligent packaging, RFID devices and flexible displays.
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Western Michigan University
17 Jul 2023

Flexible Hybrid Electronics 2024-2034

IDTechEx Report:
5 Jun 2023

Flexible & Printed Electronics 2023-2033: Forecasts, Technologies, Markets

IDTechEx Report:
20 Mar 2023


TemperPack is a packaging manufacturer that provides thermal packaging for perishable goods based on starch foam.
17 Nov 2022

Conductive Ink Market 2023-2033

IDTechEx Report:
9 Sep 2021

Printed and Flexible Sensors 2022-2032: Technologies, Players, Markets

IDTechEx Report:
9 Mar 2020


At Flex2020 Boeing presented a multi-modal sensor utilizing flexible hybrid electronics.
13 Aug 2019

Advanced Wound Care Technologies 2020-2030

IDTechEx Report: Dr Nadia Tsao
2 Mar 2016

NextFlex America's flexible hybrid electronics manufacturing institute

NextFlex, America's Flexible Hybrid Electronics Manufacturing Institute, has officially welcomed its founding members.
6 Mar 2015

2015 FLEXTECH Conference

March 5, 2015 - San Jose, Calif. - 2015FLEX, the Flexible & Printed Electronics Conference & Exhibition, successfully revealed the market pull for flexible electronics through keynote plenaries and focused technical sessions, while exhibits on the show floor attracted numerous end users. Held on February 23-26, 2015 - and for the first time at the Monterey, Calif. Conference Center - 580+ registrants saw first-hand demonstrations of end products, as well as new manufacturing tools and materials. The Flex Conference is sponsored annually by FlexTech Alliance.
13 Nov 2013

The story behind the world's first large-scale R2R pulsed light sinter

At this year's Printed Electronics USA show in Santa Clara, XENON Corporation is featuring a breakthrough in PE technology: a live demonstration of the SINTERON™ 5000, the world's first large-scale R2R pulsed light sintering system.
30 Oct 2013

See How to Print Electronics - Live at Printed Electronics USA

The world's biggest event on Printed Electronics - the IDTechEx Printed Electronics USA 2013 show held in Santa Clara, Ca on Nov 20-21 - will feature "Manufacturing Street" - a live, multi-technology, printed electronics demonstration www.PrintedElectronicsUSA.com.
3 Sep 2013

Building Electronics on Paper - Workshop by the Flextech Alliance

IDTechEx analysts attended a workshop on paper electronics held at the Centre for Advancement of Printed Electronics. Some key points and highlighted are briefly summarised in this article.
14 Jan 2013

VTT Technical Research Centre of Finland

inert atmosphere printing line, hot embossing, metal evaporation, laser ablation, sintering. Typical web width is 300 mm. The CPI works on all types of applications, not just a few like OLED and transistors. This means they are able to adapt to a greater range of customers.
18 Oct 2010

Flextech Alliance awards grant to Corning Incorporated

Flextech Alliance awards grant to Corning Incorporated to develop commercially viable methods for continuous printed electronic manufacturing on flexible glass substrates.
27 Nov 2009

Western Michigan University and Daetwyler progress Gravure Printing

Western Michigan University and Daetwyler R&D Corporation partnership. The AccuPress printing system is Daetwyler R&D's high-precision gravure press for the printing of sheet-fed, layer-to-layer applications. The unit includes many features to maintain the high-accuracy required for printed electronics uses. The unit is scheduled to be delivered to WMU in April of 2010.