Alpha Assembly Solutions

Alpha Assembly Solutions

HQ Country
United States
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Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive, flexible & printed electroncis and others.
 
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. Alpha serves the Flexible, Formable & Printed Electronics market through a comprehensive offering of Silver Inks, Carbon Inks, Dielectric Inks, Electronic Adhesives and Low Temperature Solder Pastes. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™ and Fortibond™ brands.
 
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha's Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
 
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit www.AlphaAssembly.com External Link.
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2024
3 Jun 2024

Power Electronics for Electric Vehicles 2025-2035: Technologies, Markets, and Forecasts

IDTechEx Report: John Li, Dr James Edmondson and Yulin Wang
16 May 2024

Thermal Interface Materials 2024-2034: Technologies, Markets, and Forecasts

IDTechEx Report: Yulin Wang and Dr James Edmondson
25 Mar 2024

Thermal Management for EV Power Electronics 2024-2034: Forecasts, Technologies, Markets, and Trends

IDTechEx Report: Yulin Wang and Dr James Edmondson
2023
11 Oct 2023

Graphene Market & 2D Materials Assessment 2024-2034: Technologies, Markets, Players

IDTechEx Report: Dr Conor O'Brien
17 Jul 2023

Flexible Hybrid Electronics 2024-2034

IDTechEx Report:
5 Jun 2023

Flexible & Printed Electronics 2023-2033: Forecasts, Technologies, Markets

IDTechEx Report:
2022
21 Dec 2022

Manufacturing Printed Electronics 2023-2033

IDTechEx Report:
8 Nov 2022

Sustainable Electronics Manufacturing 2023-2033

IDTechEx Report:
21 Jun 2022

Thermal Management for Advanced Driver-Assistance Systems (ADAS) 2023-2033

IDTechEx Report: Dr James Edmondson and Dr James Jeffs
2 Feb 2022

Thermal Management for 5G 2022-2032

IDTechEx Report: Dr James Edmondson and Dr Yu-Han Chang
2021
4 Aug 2021

Electrically Conductive Adhesives 2022-2032: Technologies, Markets, and Forecasts

IDTechEx Report:
2020
13 Nov 2020

Materials for Printed/Flexible Electronics 2021-2031: Technologies, Applications, Market Forecasts

IDTechEx Report: Raghu Das
8 Jul 2020

In-Mold Electronics: Material Development Opportunities

In-Mold Electronics (IME) is a process that combines printed electronics with 3D forming and molding to create 3D objects with embedded electronics. The electronics can include interconnects, sensors, rigid IC or LEDs, optical waveguides, and so on.
7 Jul 2020

Alpha Assembly

Alpha: commercializing Ag nano sintering die attach paste
31 Jan 2020

Alpha Assembly

Alpha is the market leader in providing surface mount technology (SMT) solutions, which includes solder in various forms along with conductive adhesives. This profile primarily focuses on a new product that is highly relevant for printed/flexible electronics, specifically low temperature solder. This should facilitate attaching components to low-cost, flexible, transparent substrates such as PET.
Included are:
2019
16 Oct 2019

Die Attach Materials for Power Electronics in Electric Vehicles

New IDTechEx Research report investigates the market for various die and substrate attach materials used in power electronics in various electric vehicles. It provides a comprehensive view of the industry trends, looking at the trends driving the adoption of higher performance die-attach materials.
29 Jul 2019

Metal sintering die attach materials, processes, and suppliers

This is part V of our article series.
3 Jul 2019

Conductive Inks: Power Electronics, EMI Shielding, In-Mold Electronics

Every year IDTechEx Research publishes an article that reflects the latest trends in the conductive ink industry. These articles are based on IDTechEx Research's report "Conductive Ink Markets 2019-2029: Forecasts, Technologies, Players", which is the result of ongoing research over the past eight years. This year IDTechEx will give an update on multiple less mature trends which offer high growth potential.
30 Apr 2019

Flexible Hybrid Electronics: trends in key enabling technologies Pt 1

In this article, we consider multiple approaches that are being used to enable flexible hybrid electronics.
11 Apr 2019

Reliability Comparison Of A Conventionally Soldered Super TO-247 To A Silver-Sintered STO-247 For Automotive Inverter Technologies

MacDermid Alpha Electronics Solutions, Netherlands