ความท้าทายด้านความร้อนและกลยุทธ์การทำความเย็นสำหรับบรรจุภัณฑ์เซมิคอนดักเตอร์ 3D
Jul 29, 2025
Webinar featuring content from the IDTechEx report "Thermal Management for Advanced Semiconductor Packaging 2026-2036: Technologies, Markets, and Opportunities"
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Thermal Challenges and Cooling Strategies for Next-Gen 3D Semiconductor Packaging_Webinar (76.3MB)
Thermal Challenges and Cooling Strategies for Next-Gen 3D Semiconductor Packaging_PDF (1639.3KB)