In many cases, the development and deployment of Flexible Hybrid Electronics is limited by the constraints of currently available material sets and their compatibility with existing manufacturing processes and equipment. Panasonic Electronic Materials is developing a set of FHE materials based on a unique stretchable thermosetting polymer technology which exhibits very high temperature resistance and ultra-low hysteresis. Using these materials and conventional high-volume fabrication processes, single sided, double sided and multilayer stretchable/compliant circuits have been manufactured. Additionally, copper structures can be selectively formed enabling surface mount component assembly with conventional reflow solder materials and processes.
Andy Behr is a Technology Manager with Panasonic Electronic Materials Division. He leads a research and marketing team based in Silicon Valley that that develops leading-edge materials for electronics and other emerging applications. Andy holds a bachelor degree in biology and a master's degree in business. He has more than twenty-five years of experience in material technologies such as photo resists, adhesives, encapsulants, conductive materials, fluoro-chemicals, abrasives, films and tapes. Andy began his career in research and has subsequently held positions in marketing and leadership.
Panasonic Corporation is a worldwide leader in the development of diverse electronics technologies and solutions. Since its founding in 1918, the company has expanded globally and now operates 474 subsidiaries and 94 associated companies worldwide, recording consolidated net annual sales of 7.553 trillion yen. Committed to pursuing new value through innovation across divisional lines, the company uses its technologies to create a better life and a better world for its customers. Panasonic Electronic Materials Division provides high performance circuit board laminates, advanced films, molding compounds and semiconductor encapsulation materials to global electronics manufacturing customers.
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