Mesoscribe Technologies
Mesoscribe Technologies
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United States
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Are you looking to move beyond the limits of conventional printed electronics? Let our exclusive MesoPlasma Printed Electronics capability add functionality, durability and improved performance to your products. A unique 3D additive manufacturing process with multi-material capability that produces extremely robust deposits that are compatible with a wide array of substrate materials. We excel at:
- Printed Conformal Antennas - On complex contours
- Printed Heaters - To 500W/cm^2
- Printed Thermal Sensors - Heat flux sensors and thermocouple arrays (>800C)
Proven performance in demanding applications. Discover the process that major Aerospace OEM's have been taking advantage of for years.
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